Electronics Forum | Thu Jun 29 04:34:22 EDT 2006 | Rob
Just because someone has great equipment doesn't mean they are any good at assembling quality boards. By all means check out their current capacity & contingency plans, but also assess their competance levels & output quality. Set a cunning trap fo
Electronics Forum | Mon Jul 10 12:38:19 EDT 2006 | fredericksr
Hello All, Has anyone tested the effectiveness of any process to remove lead from tinned soldering irons to RoHS acceptable levels? We have been dedicating new tips for RoHS assembly, but as our RoHS product line increases it will be important
Electronics Forum | Thu Jul 27 04:29:18 EDT 2006 | pbarton
We have our waste water tested periodicially by a local lab to ensure that we are in compliance with local discharge regulations and as part of ISO14001 approval. This analysis includes levels of metals as well as organics, but it will tell you littl
Electronics Forum | Wed Oct 04 13:06:21 EDT 2006 | greg york
Sorry Bert For some reason I'm not getting the Email notifications so appologies never saw the reply. The mettalic antidrossing agent reduces the dross to levels of est. 50% less than compared to 63/37 alloy. When used with SACP/0307 alloy and SACP/
Electronics Forum | Tue Aug 15 17:17:27 EDT 2006 | flipit
Anyone who uses Pepto-Bismol is drinking Bismuth. In the early 90s the Dept of Defense banned Antimony in solder but later repealed the ban. I drained the waves and the hot air solder leveler and replaced the solder with "No Antimony" solder. Ther
Electronics Forum | Mon Aug 21 04:36:34 EDT 2006 | Rob
Yes, appropriate storage & component handling proceedures should be followed depending on the MSL (Moisture Sensitivity Level) class of the component. Some component suppliers are now marking the MSL class on the label, along with PBT (Peak Body
Electronics Forum | Wed Sep 13 09:15:19 EDT 2006 | Rob
Hi Peter, Out of the 1.5 billion components we shipped last year, we had 3 components back for solderability issues. All 3 had been taken out of their vacuum packaging and left to oxidize for a number of weeks. We don't see it as an issue, but we
Electronics Forum | Mon Oct 02 06:41:53 EDT 2006 | saaitk
We have a customer enquiry that requires PCB assemblies to be cleaned to J-STD-001 / -004 class 3. We use both water based and no clean process chemistries. No clean flux residues are not permitted and would therefore have to be cleaned. My question
Electronics Forum | Tue Nov 07 10:16:20 EST 2006 | kevinp
The touch down sensor is probably the culprit, however make sure the head is not impacted with old solder paste and that the cylinders that flip the head are functional. I have had problems with one of the cylinders not functioning this caused the he
Electronics Forum | Mon Dec 18 12:17:17 EST 2006 | russ
Real tough to foam that no-clean formula there. Most no-cleans are notoriously difficult to foam. I assume that you have both a pressure and a flow regulator. low pressure and high flow are keys to fowm head height as well as S.G. also make sure