Electronics Forum | Fri Sep 03 10:52:39 EDT 2010 | arjan
Mark, Can you send some X-ray foto's of your LGA solderjoints, I am curious about the results of a marginal paste volume in combination with the Multicore LF318. Did you follow the recommandation of LT and use also soldermask defined pads on your bo
Electronics Forum | Tue Aug 31 04:05:23 EDT 2010 | arjan
Hi Mark, Thanks for your responce! The stencil thickness and especially the reduction of 45% are not recommend by LT, did you came to this combination experimentally? We never have the illusion to produce voiding free, but now its around the accepta
Electronics Forum | Thu Sep 02 16:55:31 EDT 2010 | markgray
I ment LF318. We have a power supply board that has 3 different types of these LGA's and i have had great success with the reductions and stencil thickness mentioned. We had to go with 4 mil stencil due to the consideration of the other large compone
| 1 |
