Industry Directory: lga (12)

Precision PCB Services, Inc

Precision PCB Services, Inc

Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider

Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.

Tianjin Reains Technologies Co., Ltd

Industry Directory | Manufacturer

Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.

New SMT Equipment: lga (133)

BGA Reballing Service

BGA Reballing Service

New Equipment | Rework & Repair Services

BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

BGA Reballing Fixture, Hi Yield

BGA Reballing Fixture, Hi Yield

New Equipment | Rework & Repair Equipment

Custom made reballing fixtures designed for your specific component.  Allows for high yield reballing of multiple parts at one time.  Use for ball attach to BGA components and for solder bumping of LGA's and QFN's.  Simply send us the data sheet and

Precision PCB Services, Inc

Electronics Forum: lga (208)

LGa soldering issues......

Electronics Forum | Mon Aug 10 12:28:17 EDT 2009 | davef

We don't know dip about your Linear Tech LGA118, but we agree with published reports that say you should have between 4800 and 7000 thou^3 of paste on the pad for a LGA. These volumes were analyzed based on volumes found successful for CGA and then e

Voiding in LGA (LT) soldering

Electronics Forum | Thu Sep 02 07:50:27 EDT 2010 | sachu_70

Just to add to my comments,solder joint voids do occur in LGA. Voids in LGA can be larger due to geometry and greater ratio of flux to solder. IPC-A-610D specifies a greater than 25% voided area is a defect for BGA, however, it does not specify the d

Industry News: lga (103)

International Conference on Soldering and Reliability (ICSR) Workshops Announced

Industry News | 2016-04-06 12:45:01.0

The SMTA is excited to announce three new workshops for the 10th Annual International Conference on Soldering and Reliability (ICSR) being held May 9-11, 2016 in Toronto, Canada. The event is co-located with the SMTA Toronto Expo.

Surface Mount Technology Association (SMTA)

Parts & Supplies: lga (8)

Panasonic Cutter N210186479AA

Panasonic Cutter N210186479AA

Parts & Supplies | THT Equipment

Panasonic Cutter N210186479AA Panasonic smt spare parts smt machine KXFB02LDA01 JOINT KXFB02LEA01 BRACKET KXFB02LGA01 PLATE KXFB02LJA00 COLLAR KXFB02LKA00 STOPPER KXFB02LLA00 COLLAR KXFB02LMA00 SHAFT KXFB02LNA00 HOLDER KXFB02LPA01 COLLAR

Qinyi Electronics Co.,Ltd

Panasonic BLOCK

Panasonic BLOCK

Parts & Supplies | SMT Equipment

We also supply following Panasonic Spare parts : N210001930AA JOINT N210007424AA BRACKET KXFB02LGA01 PLATE KXFB02LJA00 COLLAR KXFB02LKA00 STOPPER N210007491AA SHAFT KXFB02LRA00 MANIFOLD KXFB02LUA05 SHAFT KXFB02LVA00 GUIDE KXFB02M4A02 PLAT

Qinyi Electronics Co.,Ltd

Technical Library: lga (9)

Solder Joint Encapsulant Adhesive - LGA High Reliability And Low Cost Assembly Solution

Technical Library | 2016-01-12 11:01:25.0

More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.

YINCAE Advanced Materials, LLC.

MEMS SENSOR PCB DESIGN AND SOLDERING GUIDELINES - ANM001

Technical Library | 2023-10-09 15:18:50.0

This technical document provides necessary information and general guidelines for soldering and PCB design for the Würth Elektronik eiSos MEMS sensor products with an LGA surface-mount package

Würth Elektronik GmbH & Co. KG

Videos: lga (28)

Side View Camera Demo

Side View Camera Demo

Videos

BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.

Precision PCB Services, Inc

Side View Camera Demo

Side View Camera Demo

Videos

BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.

Precision PCB Services, Inc

Training Courses: lga (4)

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: lga (3)

Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures

Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,

Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures

Surface Mount Technology Association (SMTA)

SMTA Mexico Expo 2019

Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico

SMTA Mexico Expo 2019

YINCAE Advanced Materials, LLC.

Career Center - Resumes: lga (2)

Staff Process Engineer

Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control

15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience

Debug engineer or bga rework engineer

Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support

tel u later

Express Newsletter: lga (25)

Partner Websites: lga (296)

BGA Rework Training and Certification – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training

.  The lateses processes, materials, equipment and techniques for rework of BGA, QFN, LGA, PoP and other SMD components. Key Topics Include: A review of the parameters for establishing a safe thermal profile

Precision PCB Services, Inc

1913 Reflow Oven

Heller Industries Inc. | https://hellerindustries.com/product/1913-mark-5-series-smt-reflow-oven/

×   1913 Reflow Oven -Mark V Best value SMT Reflow Oven in the market. Designed for Low Cost of Ownership. 1913 Mark V Non-LGA 1913 Mark V LGA The ultimate high volume Surface Mount Technology production solution with belt speeds up to

Heller Industries Inc.


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