Electronics Forum | Thu Jun 22 11:20:13 EDT 2000 | Neil
What role does materials and process selection play in helping make products more environmentally friendly?
Electronics Forum | Mon Dec 18 01:25:47 EST 2006 | seety1981
test engineer and product engineer... Hi all, Sorry if this topic is not suitable to be in this forum.. anyway,... i would like to know what the different of the jobs scope between the Test Process and Test Product engineer in semiconductor manufac
Electronics Forum | Wed Jul 27 16:27:57 EDT 2005 | GS
It may be you should look for higher TG of Durapol Rgds GS
Electronics Forum | Wed Apr 06 08:27:12 EDT 2011 | kaschliman
Our two component suppliers use 99.5Sn/0.5Cu and 97Sn/3Ag solder (respectively) for tinning their leads. We use 98.9Sn/.66Cu/.33Ag solder in our wave solder machine. Is there any significant advantage to either tinning process regarding solderabili
Electronics Forum | Wed Jul 27 22:09:49 EDT 2005 | Ken
My policy is not to mix them. You have zero cross contamination potiental with this policy.
Electronics Forum | Wed Jul 27 16:46:48 EDT 2005 | russ
I don't think that you would need to test these. Have you ever seen any evidence of solder sticking to them? We use the same material and never notice anything besides flux staying on the bottom. Would the lead absorption if any even be of a concer
Electronics Forum | Wed Jul 27 15:54:44 EDT 2005 | Hiram
Hi everybody, We have wave solder fixtures made of Durapol and multiple wave solder machines. Most likely we�ll use the same pallets for either tin-lead or lead-free solder for a while (of course after washing the pallets). Should we test the palle
Electronics Forum | Wed Apr 09 09:44:12 EDT 2003 | iman
yes, we r profiling direct thermocouple attachment to the LGA pads. based on direct experience of yourself or others, what paste (brand/type3?/type4?/alloy?/flux%?) gives the optimal repeatable characteristic-patterns to minimize this defect?
Electronics Forum | Sat Mar 29 08:42:25 EST 2003 | davef
YiEng, MA/NY DDave There are numerous package types that now fall under the rubric of land grid. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA devices with the balls removed and with no solder on the pads. General
Electronics Forum | Sat Mar 29 01:59:09 EST 2003 | iman
Yep, only the MLF have this blowhole/pinhole issue. Other components like SOT(transistor), CAP, RES are hey-o-kie. Btw, MLF = micro lead frame (IC/LGA) package. looks like a BGA without the solder balls. has direct attachment to the PCB ENIG pads wi
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