Electronics Forum | Tue May 21 15:37:36 EDT 2013 | armelinda
I am looking for a service providing non contact PCB flatness measurement for open board SiP assembly. It was returned for failure analysis with complaint that assembly does not solder properly onto customer system board. Since there are remnants o
Electronics Forum | Thu Apr 14 13:24:18 EDT 2016 | davef
I doubt that your problem is driven primarily by irregularities in your circuit board. My bet is that you’re seeing defects caused primarily by the warpage in your LGA. Consider using advice often given for minimizing warpage caused defects in BGA
Electronics Forum | Thu Apr 21 20:09:18 EDT 2016 | adamjs
I have tried adding more paste but get shorts and excess flux as I get above a 7 mil stencil. You do need the thicker stencil. To prevent the shorts, you need to have your pick-and-place machine probe the exact height of the board (at multiple loca
| 1 |
