Electronics Forum: lifted pads (Page 1 of 22)

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Tue May 20 06:00:33 EDT 2008 | roc2x

Im qualifying a new PCB. I run 2 diff supplier. Supplier A has Zero failure. Supplier B has 4 failure all having Lifted PAD on Bga same location and same location pads that lifted. How can I prove that the PCB have problem? Input : Both run in same o

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Tue May 20 08:25:26 EDT 2008 | davef

Well something is different isn't it? * Paste * Part supplier * Board fabrication * Was the profile that you reference the measured temperature or the the settings keyed into the oven? The cross sections seem to show less than expected ball collapse

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Mon Jun 09 06:37:42 EDT 2008 | roc2x

Hi, After reflow process we do Automatic inspection and after that direct to 5DX machine to check all the solder joints and we detected it at 5DX inspection. This card havent go to any testing.

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Tue May 20 09:34:28 EDT 2008 | roc2x

Well something is different isn't it? * Paste * > Part supplier * Board fabrication * Was the > profile that you reference the measured > temperature or the the settings keyed into the > oven? > > The cross sections seem to show less > than exp

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Wed Jun 11 09:35:07 EDT 2008 | grics

Out of curiosity, what is your top side peak temp @ reflow? Have you inspected the boards prior to SMT (at your 5DX machine?) Also, have you tried to run the board through reflow with out any parts or bga placed and inspected? I how long are you in

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Wed May 21 04:50:51 EDT 2008 | aj

Hi all, We had similar problems a while back. Boards would fail at test but if you applied pressure to the BGA they would pass. Turned out that during the PTH assembly process the Operators were flexing the cards during the insertion of an Oupin C

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Mon Jun 16 12:06:52 EDT 2008 | realchunks

Seen this with our old board house. The uncured board is causing your problem. Hard to catch, but looks like you have all your ducks in a row. We presented the exact same thing to our board house, and naturally they blamed our process, handling, a

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Tue May 20 17:09:13 EDT 2008 | davef

Sorry, we didn't do a good job of understanding your question. For more on delamination, look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=54655 ... but we're not so sure that this is a straight delamination issue, because: * One

Regarding BGA Pad Lifting

Electronics Forum | Tue Feb 09 17:11:14 EST 2016 | vaghelarajeshh

I have pad lift issue during the rework on Motorola box DSR600 which has the fault of No log and No boot. Pad lifting pattern is on four corners. I have checked the temeprature difference between the corners which is sam as center. I have attache

Regarding BGA Pad Lifting

Electronics Forum | Wed Mar 01 02:10:05 EST 2017 | soldertraining

Hi! I am Bob and pls forgive me if technical words I use are wrong. What may cause the BGA solder pad lift before or after reball? I am having problems where solder pad lifted during removal of bad solder ball. It also occurred during reball, where t

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