Electronics Forum | Fri Aug 13 04:12:41 EDT 1999 | ray hare
| | I am currently involved with designing a pcb which will use 225 pin bga,s | | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | | use the middle 6 or 7 rows of balls as the
Electronics Forum | Wed Aug 11 15:48:54 EDT 1999 | JohnW
| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or
Electronics Forum | Fri Aug 13 07:26:06 EDT 1999 | Brian Conner
| | We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave
Electronics Forum | Fri Jul 30 17:22:48 EDT 1999 | Dave F
| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so
Electronics Forum | Mon Aug 02 18:52:57 EDT 1999 | Graham Naisbitt
| Very shortly I will be evaluating OA flux and aqueous cleaning to replace our RMA and solvent cleaning process. I am primarily interested in batch aqueous cleaners for reasons of budget, floor space, etc. I am concerned about the ability of H2O t
Electronics Forum | Thu Jul 29 12:33:38 EDT 1999 | Wolfgang Busko
| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into
Electronics Forum | Mon Jul 26 19:32:03 EDT 1999 | Steve Gregory
| Can anyone give me the virtues of SMT package castellations vs. no castellations with particular reference to the ruggedness and reliability of the solder joints? Any references or studies that you can point me to? Also, although I'm in favor of
Electronics Forum | Mon Jul 26 18:03:45 EDT 1999 | John Thorup
| We only do rework with SMT components or a small amount of SMT work. We are having a hard time keeping the components safe throughout the handling process of removing one or two components, and issuing them to an operator for processing or inspect
Electronics Forum | Thu Jul 29 21:00:27 EDT 1999 | Dave F
| Thanks Earl for your insight! I sometimes feel conspicuous as one of the few women I've seen frequenting this board, but everyone's been helpful and has resisted the overwhelming temptation to pat me on the head. | | From what you and some of the
Electronics Forum | Thu Jul 29 12:24:59 EDT 1999 | DLKearns
| | We are going to smt ic's on the component side of our pcb's. | | The problem is we are going to have to do this by hand. | | We have a hot air station and vac pencil, but How reliable is this process. | | We've tried it on proto's and had some sh
