Electronics Forum: like (Page 1126 of 1214)

Re: Solder surface tension

Electronics Forum | Sat Oct 09 10:30:24 EDT 1999 | bix

| | | | | Can anyone tell me the formula/method to determine | | | | | the amount of weight that solder's surface tension can support. | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | of a board during a top side refl

Re: Solder surface tension

Electronics Forum | Mon Oct 11 12:49:11 EDT 1999 | John Thorup

| | | | | | Can anyone tell me the formula/method to determine | | | | | | the amount of weight that solder's surface tension can support. | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | of a board during a top s

Re: Solder surface tension

Electronics Forum | Tue Oct 12 05:09:13 EDT 1999 | Brian

| | | | | | | Can anyone tell me the formula/method to determine | | | | | | | the amount of weight that solder's surface tension can support. | | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | | of a board during

Re: Micropax Connector Repair (Through Hole Version)

Electronics Forum | Fri Aug 13 09:51:25 EDT 1999 | Dave F

| Ladies and Gentlemen, | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous

Re: Micropax Connector Repair (Through Hole Version)

Electronics Forum | Fri Aug 13 13:00:08 EDT 1999 | Earl Moon

| | | Ladies and Gentlemen, | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav

Re: Micropax Connector Repair (Through Hole Version)

Electronics Forum | Fri Aug 13 13:25:09 EDT 1999 | ScottM

| | | | Ladies and Gentlemen, | | | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I wou

Re: Suspected Pink Ring

Electronics Forum | Wed Jul 28 16:36:30 EDT 1999 | Earl Moon

| | | While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That w

Re: product changeovers

Electronics Forum | Sat Jul 03 01:09:29 EDT 1999 | DEAN

| | I am currently looking into ways to decrease SMT changeover times. I work in a high mix-low volume factory. We use Fuji CP's and IP's for SMT production. I would appreciate hearing from anybody that has some proven methods for reducing setup/chan

Re: Off Pad Printing

Electronics Forum | Wed Jun 30 10:00:33 EDT 1999 | Mcox

| | | | | | | | snip | | | | | | | | | John and Dave, | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the pa

Re: Off Pad Printing

Electronics Forum | Wed Jun 30 11:07:16 EDT 1999 | Earl Moon

| | | | | | | | | | snip | | | | | | | | | | | John and Dave, | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us d


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