Electronics Forum | Tue Apr 26 18:23:30 EDT 2005 | russ
How does your machine recognize the part? Does it use vision for ball inspection or a just a body scan? What is the aperture size on the stencil? Have you calculated the area ratio? What is the aperture shape? What type of paste are you using? is
Electronics Forum | Wed May 04 13:13:43 EDT 2005 | Jimmie
We have seen the black dot on the BGA pad after the component has been removed from a PCB. When most likely could this corrosion have occurred, while the component was in storage, during manufacturing of the unit? We have a number of these BGA's th
Electronics Forum | Wed May 04 22:04:55 EDT 2005 | davef
First, you cannot determine if this is "black pad" by looking at it. You must do laboratory analysis, either microsectioning or EDS. [But it sure sounds like "black pad."] Second, if it is black pad, it was created by the company that fabricated t
Electronics Forum | Thu May 05 09:17:58 EDT 2005 | jimmiem
I tried soldering to several of the black pads and was successful, the solder stuck with no hesitation. so i guess this is not truly "black pad"? would that be a correct statement? What causes this blackening that looks like oxidation under the mic
Electronics Forum | Wed May 11 08:41:46 EDT 2005 | Rob.
Cheers Jerry, forgot the most important one! Also want it to do: laser 3D volumetric solderpaste inspection Pre-reflow (including fault logging by placement machine & individual feeder) Post reflow solder joint inspection & handle lead free joints
Electronics Forum | Tue May 10 15:27:36 EDT 2005 | amejia
We actually did try dots, 1/8" to be exact. We found that they were hard to peel off using just your fingers. Also, the manufacturer punched the dots too deep and ended up going through the backing on many of them. However, using tweezers, it didn
Electronics Forum | Thu May 12 15:35:16 EDT 2005 | msivigny
Hi Sam, I'm afraid I can't answer this question in this forum. I'm sure many people would like to know which model or brand is better than the next, but even if we had the data, we would not share it. Our independent measurement services and associat
Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto
We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top
Electronics Forum | Thu May 19 13:03:18 EDT 2005 | russ
On the non-wetted holes put a solder iron to them and see if they "bubble" if so, you have some outgassing in your PCB and they will need to be baked prior to assembly. If this is okay I would investigate the grnd layer that was mentioned. What is
Electronics Forum | Thu May 19 21:53:07 EDT 2005 | KEN
Is it possible your board is warping and skip plating? Have you run a lev-check? What does your contact patch look like? Do you have ice cikles (spelling???) or solder "flags". IF yes, your flux is consumed or nonexistant. What is your dwell time
