Electronics Forum | Wed Nov 22 15:09:52 EST 2000 | Finepitch Services
Chryzs, I've used AIRVAC and SRT (with their old adjustable 4 piece nozzle system). I also saw the APE Chipmaster... Here's my 2C after all that: Whoever claims he/she has a user friendly system is a big liar. The words are correct but the order is
Electronics Forum | Wed Nov 29 10:50:24 EST 2000 | blnorman
Vacuum casting (same process used to make solid rocket motors) should remove any air from the paste. We had thought of pressurizing the tubes to remove the residual paste, but that would entrap air. The problem of tubes sitting out for different
Electronics Forum | Sun Nov 19 23:28:38 EST 2000 | Richard Metrton
Hi, We are looking at both the Vitronics Soltec and the Ursa Hotflow with the flux management options and am intrested to hear what others on the forum think about these two products. We really want something low maintenance, and works well. I gues
Electronics Forum | Thu Nov 16 03:41:43 EST 2000 | Willem Combrinck
Hi everyone. I'm an industrial engineering student working at a manufacturing company in Cape Town, SA. Recently my boss wanted to know the causes of our downtime in SMT. Things like setups, unscheduled maintenance, debugs etc came up while I was doi
Electronics Forum | Mon Nov 13 08:24:03 EST 2000 | G. English
Richard, From your description of the IC, as Wolfgang indicates it sounds like a 20mil pitch device, the aperture design really depends upon your solder paste particle size, we use a type 3 solder paste with a mesh size of �325 / +500microns. This is
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Wed Nov 01 08:17:39 EST 2000 | Adam
we have a variety of products which we build and manufacture and build on our site, 90% of which go over the wave solder. What I would like to know is when designing a WSC how do I know what the correct angle of the aperture is in relation to the wav
Electronics Forum | Fri Nov 03 11:08:29 EST 2000 | Phil
Hi there!!! Actually, all mentioned ideas were significantly related to the cause of tombstoning. But, based on what DL said, you have to check the placement of your 0402. Coz, based on experience, i evaluated the different variables for the root
Electronics Forum | Fri Oct 27 10:35:36 EDT 2000 | Chris
We are having problems soldering this motorola part(XPC860TZP50B5). After reflow, some of the balls appear to be sitting on the reflowed paste rather than wetted to it. We reviewed parts and found oxidation on many. We have four other BGA's, from oth
Electronics Forum | Thu Oct 26 12:36:02 EDT 2000 | Sal
Guys! witnessing a problem i've never seen before.Manufacturing a mixed technology with HASL finish, BGA,QFP's,fuses etc..etc. I've profiled the product, but what i'm witnessing is really weird. I've got a 0.020" QFP which is at the edge of the board
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