Electronics Forum: like (Page 936 of 1214)

Adding new line

Electronics Forum | Sat Jun 09 10:38:39 EDT 2012 | anton99

Thank you both ( Gnus and Phil) for the replies. I will try to answer both with a new post. I like the idea of the stock room splitting the reels but our reels are released to the floor where the Magload ( Kit building) area stores them and builds t

Adding new line

Electronics Forum | Wed Feb 27 08:31:02 EST 2013 | anton99

We are a OEM and growing pretty fast. The like the idea of setting up common components on the machine. It makes sense from a set up perspective. All of our set up is off line but the set up usually lasts longer than the SMT run so we have some spora

Another AOI thread

Electronics Forum | Mon Jun 18 07:07:35 EDT 2012 | buckcho

Thank you for the response, but the machine selection is not made by me, I only evaluate the machines. So two days ago I visited a company that has a Viscom AOI. I had good impressions about the machine but there were couple of things I didn't like:

Stencil aperture positional accuracy

Electronics Forum | Thu Jun 14 06:13:47 EDT 2012 | ccgooi

I am running a product with board size ~18"X16". I faced stencil aperture positional accuracy issue which slightly shifted at both end of stencil at positive and negative in X direction thus causing solder paste to pad mis-registration. Due to this s

Selective Soldering Issues

Electronics Forum | Fri Jun 22 21:07:08 EDT 2012 | tank1266

I have had Selective issues such as yours on two very different Selective Solder Machines. I was able to eliminate these issues by using Alpha EF-9301 wave flux with any SAC305 solder. It's a more aggressive flux, but really made the difference. Anot

Blow Holes voids in solder fillet on caps

Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef

Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as

IR Rework Machine

Electronics Forum | Thu Jun 28 15:22:59 EDT 2012 | spitkis2

Would like to ask end users or those with experience using infra red rework equipment (specifically when the top heater is IR) the following: 1. Can you successfully rework Package On Package (PoP) type devices? With heat directed through the packa

QFN aligment issues

Electronics Forum | Fri Jun 29 10:56:56 EDT 2012 | jorge_quijano

Hi guys, I need your advise on this, I have a very uncommon PCB design (at least for me, I've never seen anything like this...) it is 32" x 18" x 0.062" and has 9 QFNs that are driving me crazy, I'm not able to get a good alignment, I can get a mediu

baking out pcbs after reflow process

Electronics Forum | Thu Jul 05 11:26:08 EDT 2012 | cobham1

I need help with how long do I need to bake out double sided PCB's that have been cleaned. The units will not be reworked but instead will be moved on to hand stuffing. I have looked in IPC CH-65B and J-STD-033C. I get information for parts if I am r

baking out pcbs after reflow process

Electronics Forum | Thu Jul 12 11:56:20 EDT 2012 | hegemon

You might try to complete all your soldering within a 72 hour or less time frame. For all intents treat your board like a moisture sensitive component after you have baked and completed SMT reflow. Wash, blow dry, and go direct to stuffing and com


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