Used SMT Equipment: line measurement (Page 1 of 28)

Mydata MY300SX-11

Mydata MY300SX-11

Used SMT Equipment | Pick and Place/Feeders

Software Version 4.2.4e Electrical two-pole test Electrical transistor test Shared databases Hydra Electrical measurement Hydra high speed Line mode Fast place sequence Hydra large component range Hydra fine pitch In/Out conveyor board trai

Baja Bid

ASC International ASCII paste thickener, 3D SPI-6500 paste thickener

ASC International ASCII paste thickener, 3D SPI-6500 paste thickener

Used SMT Equipment | Pick and Place/Feeders

Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser

KingFei SMT Tech

Koh Young SPI KY8030-3

Koh Young SPI KY8030-3

Used SMT Equipment | SPI / Solder Paste Inspection

Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin

Qinyi Electronics Co.,Ltd

Koh Young KY8030 2XL

Koh Young KY8030 2XL

Used SMT Equipment | SPI / Solder Paste Inspection

KOH YONG/SPI KY8030 2XL MACHINE KY8030-2XL MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square, irregular polygon, circle)/volume/spacing (X, Y axis)/angle

Qinyi Electronics Co.,Ltd

Mydata My9

Mydata My9

Used SMT Equipment | Pick and Place/Feeders

Great Unit for an NPI Line!  Runs Agilis with latest software Model:  My9 Vintage: 1998 SW Version: TPSys 3.3.2 Hours:  On time: < 1400 days.  Placement time: < 600 days Details: • Electrical Two-Pole Test &bu

Lewis & Clark

Cyberoptics SE300 Ultra 3D SPI

Cyberoptics SE300 Ultra 3D SPI

Used SMT Equipment | SPI / Solder Paste Inspection

Vintage:  2008 Description:  3D Solder Paste Inspection Details: • 3D sensing  system w/ built-in fiducial camera and lighting • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max PCB width: 20” x 20” • Max inspection

Lewis & Clark

Vi Technology 3D XPi 400L

Vi Technology 3D XPi 400L

Used SMT Equipment | Visual Inspection

Make: VI Technolgoies Model: 3D XPi 400L Solder Paste Inspection Vintage: 2008 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow

Lewis & Clark

Mydata MY100 SXE

Mydata MY100 SXE

Used SMT Equipment | Pick and Place/Feeders

Make:  Mydata Model: My100 SXE Vintage:  2012 Software:  TPSys 2.9.25c Details: • Electrical two-pole test • Electrical transistor test • Optical Centering • Barcode Reader • Conveyor • Shared da

Lewis & Clark

Mydata My100SX-14

Mydata My100SX-14

Used SMT Equipment | Pick and Place/Feeders

Make: Mydata Model: My100SX-14 Vintage: 9/2010 Description: Pick & Place Software Release: TPSys 4.2.3b for Ubuntu Linux Details: • Electrical Two-Pole Test • Electrical Transistor Test • Shared Databases • HYDRA &bu

Lewis & Clark

Mydata My200LX-14

Mydata My200LX-14

Used SMT Equipment | Pick and Place/Feeders

Make:  Mycronic Model: My200LX-14        Vintage:  2014 Description: Pick & Place Software Release:  TPSys 4.3.2b for Ubuntu Linux Details: • Electrical Two-Pole Test • Electrical

Lewis & Clark

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