Electronics Forum: lisas and notes (Page 1 of 6)

wave pallets and titanium

Electronics Forum | Thu Nov 15 12:11:40 EST 2007 | George

I use Pentagon EMS (503) 924-2747 with Chad Haima. Note: I do not get a penny for referals. I just like the service, super fast, high quality and excellent customer service. I have worked with them for about 4 years. Thanks, George

Dye and Pry

Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq

Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the

Component Obsolescence and Availability

Electronics Forum | Thu Mar 31 12:13:28 EDT 2022 | cbart

That is a tough one because of package size I agree, as noted previously it would be good to know what the current PCB pad layout is. first thought does go right to an adapter board of course! is this a volume build or just 20-50 pcs? dead bug and ha

PDBE and PBB replacements???

Electronics Forum | Mon Mar 21 09:33:25 EST 2005 | davef

RoHS Substance RoHS MCV Limits Typical Testing Approaches Lead 1000 ppm* Wet chemical digestion followed by ICP (Inductively coupled plasma) or AAS (atomic absorption) spectroscopy XRF (X-ray fluorescence) spectroscopy Cadmium 100 ppm Wet

IP1 and SSOP28

Electronics Forum | Tue May 18 21:43:02 EDT 2010 | ashley

Hello mickd, 1) The EL data & Vision_type is NOT necessary when using MCS30 for IP1 machine. note : your input of the above might have cause confusion during VP, hence the OS error. 2) I would suggest the following... 2a) lower the Lead_check_are

Mydata Pick and place

Electronics Forum | Wed May 09 12:07:52 EDT 2001 | caldon

My personal favorite is the Siemens F series and the UIC GSM platform. Both Siemens and UIC have awesome resources for csp, flipchip and baredie processing - Siemens= Dan Baldwin from GaTech; UIC = George Westby from UIC labs. My second choice would

CCGA and overprinting?

Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef

On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].

PDBE and PBB replacements???

Electronics Forum | Fri Mar 11 18:47:54 EST 2005 | davef

JD: It's important to note that FR-4 does not contain PBB or PBDE. The bromine in FR-4 epoxy comes in the form of tetra-bromo-bisphenol A [TBBA], which polymerizes and become part of the cross-linked epoxy. Bromine, in the form of hydrogen bromide, i

Inspection and splicing

Electronics Forum | Tue Aug 21 08:34:03 EDT 2007 | rgduval

We have the same problems with cut/tape parts. But, we specialize in short-run prototypes, so I don't have much of a choice but to deal with it, and find a way to make it as easy as possible. We just demo'd a splice tool from Sierra Electronics (ww

UPS and ROHS Compliance

Electronics Forum | Thu Jun 15 18:15:34 EDT 2006 | nickel

If you have time, download the free Practical Guide to Understanding the Scope of the WEEE and RoHS, you will find what they say about UPS. They consider UPS out from the field of application of RoHS. ORGALIME (Bruxelles)is the European Engineering

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