Electronics Forum | Tue Feb 23 14:17:18 EST 2010 | vleasher
Our rep is looking into our issue also. We already received samples for testing. We are looking at using 2-3 syringes a year of each which would be approx $1600 in waste per material.
Electronics Forum | Tue Feb 16 12:49:59 EST 2010 | esoderberg
not sure what you are looking for but I do a fair amount of low pressure molding of my electronic assemblies using a loctite macromold product in a moldman 8000 machine. This machine is made by Cavist. I have 4 of these machines running 2 shifts/6 d
Electronics Forum | Tue Feb 21 19:14:16 EST 2012 | hegemon
Have had good results with Loctite 3536 and Hysol 4527. The 3536 is easier to use and handle, and can be reworked if needed. I have no relation to, nor receive any benefit from any above mentioned company. `hege
Electronics Forum | Fri Feb 24 17:29:56 EST 2012 | grantkim
I use Loctite 3567. here's a link to the Data sheet. http://65.213.72.112/tds5/docs/3567-EN.PDF
Electronics Forum | Thu Jun 04 15:25:44 EDT 2015 | markhoch
I have a sample that I currently using as a paperweight on my desk. I'm going to test it on October or November. I'll keep you posted!!
Electronics Forum | Fri Jun 10 11:39:33 EDT 2016 | ttheis
Haven't had to do this yet but what about an adhesive? Maybe an instand bonding adhesive from loctite or similar? The difficult part would be finding something fast drying with a high enough temperature rating.
Electronics Forum | Mon Mar 06 15:51:38 EST 2017 | bk
The one i've been using on some thermally diverse boards with great success has been henkel loctite mfr 301. It's alcohol based not quite the solids you are looking for but close it's 5.5-6.5 solids and it is no clean.
Electronics Forum | Wed Apr 18 14:17:48 EDT 2018 | esoderberg
Further divide the ground block into more than 4 panes. Also think about using, assuming you have good placement of using Loctite chip bonder on two opposing corners. Lots of ways to get good results
Electronics Forum | Fri Oct 02 06:39:36 EDT 2020 | SMTA-64386317
I am using Bonotek 3400UF and Hysol for underfill application. What is your challenge on underfill process.
Electronics Forum | Mon Oct 05 01:20:46 EDT 2020 | SMTA-64386317
No pre heat the board and only apply at 2 sided of component. Yes, there is bleeding but as long did not covered nearby component is acceptable. We are using UV oven for curing.
