Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C
Electronics Forum | Fri Aug 23 12:35:09 EDT 2002 | msjohnston
Has anyone done a study or know of one that addresses the flow / no-flow underfill differences for CSP devices. My main interest is in the reliability of the CSP and underfill. Any help would be great. Thanks, Mike
Electronics Forum | Fri Aug 23 18:51:00 EDT 2002 | edahi
weve done a few evaluations for the no-flow underfill and for the reliability I think it has already passed MRT L3 @ 220C reflow. What is it specifically you're interested about the flow u/fill??
Electronics Forum | Fri Jun 08 15:37:41 EDT 2007 | ck_the_flip
Jim: I have limited knowledge, but here's what I know: 1. Yes, it's a standard process. In today's SMTNet, it's rarely mentioned, and few people reply to postings. 2. Nope. It's a "specialty" piece of equipment for most CEM's. Depending on you
Electronics Forum | Thu Dec 01 00:34:15 EST 2005 | pyramus
Guy's another question, how about any recommendation what type of adhesive to use as underfill for BGA during lead free process? Currently, we are only using Loctite 3609 & 3515 as adhesive we use 3515 as BGA underfill during normal leaded process s
Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo
No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux
Electronics Forum | Wed Mar 04 22:57:05 EST 2009 | davef
Underfill epoxies may be classified into major groups [Capillary Underfill Manufacturing Development and Characterization for 2nd Level Electronic Interconnect Processes; B Salom�n; University of Puerto Rico, Mayaguez Campus; Dec 2004]: * Capillary.
Electronics Forum | Wed Mar 04 14:35:16 EST 2009 | clampron
Good Afternoon Everyone, I have a customer who is inquiring as to the use of a no clean solder paste on their RoHS assembly. We are currently building this with OA, cleaning and then underfilling the QFN, BGA comonents after a sucessful ICT. Does any
Electronics Forum | Fri Mar 19 12:17:15 EDT 2010 | stepheniii
Be carefull if you go to no clean. Or be prepared from complaints from the test department regarding their ICT pins getting dirty.
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