Electronics Forum | Mon May 07 16:49:59 EDT 2001 | davef
Ashok, What in earthly heaven does this question have to do with "site support"? You can�t always get what you want, but sometimes you get what you need. Some leads are: * The proposed IPC cable/wire harness document is now IPC/WHMA-A-620 and go
Electronics Forum | Sat May 12 00:04:36 EDT 2001 | zam_bri
The product I'm running currently consist a mix of 20 mil pitch QFP, 50 mil pitch, 0402, BGA and variable size of connectors from small to big, on OSP finished PCB. Running intrusive reflow with a mix packages is a real headache, esplly when you hav
Electronics Forum | Fri Jun 15 14:05:20 EDT 2001 | CPI
In response No that�s not all you need to think about, but lets look at each and then talk of others. a)The condition of the solderable surface on boards (and components) degrades over time or can be supplied in poor condition (to thin or thick HASL
Electronics Forum | Thu Jul 05 19:39:19 EDT 2001 | davef
I had forgotten that it was you that was on the Sipad adventure. [But then again, who can keep track of yer aliases? ;-)] You just go from one adventure to the next. Expanding On Dave�s Hi-Test Flux Method Theory � PASTE: Yes, contact your favorit
Electronics Forum | Tue Oct 12 16:26:01 EDT 1999 | Jeff Sanchez
| | | | We have three buckets filled with leftover solder paste from our screen printing process. Kester has informed me that they no longer take paste, but only dross and pot dumpings. Does anyone know if there's someplace I can recycle this, or a
Electronics Forum | Mon Oct 11 13:44:29 EDT 1999 | Dave F
Ken: Since Earl is no longer here, I guess I'll bite on this. Your questions are very broad and difficult to answer specifically. So, I'll give you broad and non-specific answers. | Hi, | | We are using mixed technology in our PCBA. Would like to
Electronics Forum | Tue Oct 05 14:38:06 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam
| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run
Electronics Forum | Fri Oct 01 00:18:18 EDT 1999 | Earl Moon
| | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control
Electronics Forum | Fri Oct 01 09:03:25 EDT 1999 | Dave F
| | | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process contro