Electronics Forum | Tue Nov 17 08:41:20 EST 1998 | Chrys
Hi folks, Sorry to waste space on the forum with this stupid little detail thing, but I figured it was the easiest way to get the message out to everyone. My email address got changed with our last corporate re-org. We are now Siemens Information
Electronics Forum | Thu Sep 10 09:44:05 EDT 1998 | Earl Moon
| | Can anybody point me to a Standard that provides details on the use of Wire Links for the repair of SMT PCBs, e.g. the maximum number of permissible links, the material to be used, the method of joint etc.? | Dave: ANSI/IPC-R-700 answers many of
Electronics Forum | Thu Sep 10 17:26:56 EDT 1998 | Dave F
| | | Can anybody point me to a Standard that provides details on the use of Wire Links for the repair of SMT PCBs, e.g. the maximum number of permissible links, the material to be used, the method of joint etc.? | | Dave: ANSI/IPC-R-700 answers man
Electronics Forum | Mon Aug 17 21:22:55 EDT 1998 | Brian S. Bentzen
I don't know a lot about the WEB, my company's interface, or the differences between various browsers and versions. I do know that since your change over my response has gotten so slow that I no longer can spare the time to read the forum. Only occ
Electronics Forum | Tue Aug 04 16:30:36 EDT 1998 | Jim Price
| I am considering of Philips FCM for the next production. | But I have heard a rumour saying this machine is not capable for checking the lead polarity due to the laser scan system. | i.e. SOT might be populated in wrong direction. | Can somebody ad
Electronics Forum | Fri Apr 24 20:00:02 EDT 1998 | D.Lange
| | I use SMART WIPE for stencil cleaning but it cost too much. | | Did anyone know any product that cost cheaper? | | Thanks-princeton S. | We use "SMT Stencil Cleaner" from JNJ Industries. | It works great with paste but not 100% with epoxy. | It
Electronics Forum | Sun Jan 11 11:59:13 EST 1998 | Bob Willis
VP does work well for BGA Technology but it is not any great improvement on convection reflow. It has been stated in a coulpe of articles that there is no delta T difference with VP from the surface ofthe board and under the BGA. That is not true jus
Electronics Forum | Tue Aug 21 08:44:48 EDT 2001 | caldon
A) The standoff height of some uBGA components does not allow water to penatrate under the component. B)Water soluable may dilute the flux and not remove it all together. This can be tested with Ion Chromatography. C) Water soluable in some cases ne
Electronics Forum | Thu Aug 30 21:25:37 EDT 2001 | davef
Oooo, nice machine. For chuck repair, try: Mt Sterling Industries POBox 670 Mt Sterling KY 40353 606.498.1015fax4156. This is not rocket science. A local machine shop could probably do just as nice of a job. For newer chucks, try the brokers list
Electronics Forum | Thu Oct 25 04:52:17 EDT 2001 | Vai
I'm running intrusive reflow. What happened was when the board went thru' the first reflow ( which is secondary side ), at Post reflow, I can see the solder joint quality is very good smooth and shiny. But when we proceed with the 2nd reflow, at Post