Electronics Forum: low (Page 321 of 348)

Air-Vac stuff

Electronics Forum | Tue Aug 17 09:59:50 EDT 1999 | Earl Moon

I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the adve

Re: Aqueous Cleaning

Electronics Forum | Fri Jul 30 20:11:35 EDT 1999 | Mike Konrad

It is true that the use of saponifiers (and other water soluble additives) will lower the surface tension and aid in under component penetration. It is also true, however, that other specific design features within a batch machine can also aid in un

Re: Bare Copper Pad Reflow Soldering

Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon

| | I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | | This ceramic su

Re: automatic stencil printers

Electronics Forum | Tue Jul 13 14:03:33 EDT 1999 | Earl Moon

| We are looking to automate the paste printing portion of our SMT process. We are looking at used equipment from DEK and MPM from 1994 onward.(DEK 260 & 265 MPM AP20 & AP27) Does anyone have some feedback or concerns with any of these machines? Does

Re: A Blurb about Fujicam

Electronics Forum | Thu Jul 08 15:42:57 EDT 1999 | Earl Moon

| Snip | | John, | | | | You said a bunch. My biggest problem running Fuji, Panasonic, or Sanyo high speed stuff is that they are meant to run free. They are meant, in my mind, to run as thoroughbreds. | | | | I watch 6" reels placed on feeders, pl

Re: Water Batch Cleaners

Electronics Forum | Mon Jun 28 13:12:34 EDT 1999 | Graham Naisbitt

| | We are anticipating switching from RMA to OA flux for both reflow and wavesolder in the next few months. If you use a batch cleaner running DI water only I would like to hear your experiences. How is it for cleaning under low standoff component

Re: Hot Bar Mfg.

Electronics Forum | Wed Jun 16 14:06:01 EDT 1999 | Jagman

| | | | A potential customer of our is inquiring if we have capability | | | | for Hot Bar manufacturing in the PCBA manufacturing world. If someone can explain to me what this entails, I would greatly appreciate it. Thank you. | | | | | | | One

Re: Exhausting of flux in reflow ovens

Electronics Forum | Fri May 14 15:03:19 EDT 1999 | lima

| | Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? | | | | My concern is the volatiles in my WS629 solder paste may be

Re: BGA rework : IR or convection

Electronics Forum | Wed May 19 10:56:52 EDT 1999 | Glenn Robertson

| | | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | | All other tips are also welcome. | | | | | | Thanks | | | | | Philip, | | M

Re: Radial capacitors have water gain

Electronics Forum | Tue May 11 00:47:59 EDT 1999 | P.L. Sorenson - Technical Consultant

| | | | | | | I left the company before this thing ever got resolved, so I don't know the answer, but here's what we did to get boards out the door. Baked them in a desicating oven. You know, the kind that pulls vacuum? It was a regular overnigh


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