Electronics Forum | Thu Mar 28 13:19:14 EDT 2019 | davef
There is no industry standard for BTC stand-off height. "IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT (BTC) Components" just finished "Final Draft for Industry Review" in December 2018. It mentions stand-off height
Electronics Forum | Mon Oct 31 13:31:19 EDT 2011 | davef
We're not sure what a 'sticky roller' is, but will it: * Remove ionic materials * Leave no residue * Clean the walls of through holes and vias * Clean under low stand-off BGA and LGA
Electronics Forum | Thu Feb 01 15:36:42 EST 2018 | davef
Not to be repetitious, I just don't remember if this has been said or not, I'm old, give me a break. Some people have found that DI water is too thick to properly remove flux residue under low stand-off components.
Electronics Forum | Tue Apr 01 09:36:25 EST 2003 | davef
You're correct. There is no way you can aquous clean under a low stand-off part like a LGA. Your approach seems reasonable, given your constraints. [As long as your customer is paying, what the hey!!! Give 'em what they want.] Consider joining t
Electronics Forum | Fri Feb 11 05:32:31 EST 2000 | Dean
Your customers design and your process capability would determin this (W/S vs. noclean). EX. Can you clean adequately for low stand off components? I have some BGA products which operate at 20GHz (atenuation and cross-talk is off the charts. )No wa
Electronics Forum | Tue Oct 17 21:59:47 EDT 2006 | jovial_guy23
Hi Steve, I agree with you that cleaning under LCC's is often difficult but its not impossible. In order to clean the residues, the most important thing to consider is the right compatibility of the fluxes with the cleaning chemistry. There are seve
Electronics Forum | Fri Nov 11 01:48:05 EST 2011 | julien
Thanks guys, But for the cleaning process we already have a chemical product to clean flux residues and other contaminant. But it seems that we can't rinse properly under low stand-off components and we find trace of our chemical under some ceramic c
Electronics Forum | Wed Jul 14 11:26:51 EDT 2010 | davef
Probably, you need to make the same presentation to your customer that you made to your boss when you proposed changing to low-residue fluxes. Hey boss [customer], here's what's GREAT about low-residue flux. Here's how we can: * Lower our unit cost
Electronics Forum | Tue Mar 13 11:50:21 EST 2001 | gsmguru
Here is some general things I usually ask myself when having trouble with BGA's What type of BGA ? Pitch/Bump Dia etc. Smaller bumps sizes & tighter pitches require more attention. This also impacts stencil aperature design & paste selection. Was
Electronics Forum | Sun Jul 11 15:08:33 EDT 1999 | George Henning
I am examining cut & form PTH component prep equipment to help in our manual PTH insertion process. We need the ability to process both axial & radial with snap-in and stand-off capability. Low volume with the ability to feed bulk, T&R, or Stick. Any
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