Electronics Forum | Tue Apr 08 22:41:22 EDT 2008 | davef
Duno. Which LPI Solder Mask are you using?
Electronics Forum | Tue Apr 08 15:27:33 EDT 2008 | arminski
hi experts, need more info on what's happening with the LPI Solder Mask on an FR4 PCB during reflow of both Leaded and Lead Free Process? Do they become soft as well while exposed to the extreme temperatures? regards,
Electronics Forum | Mon Apr 21 14:04:24 EDT 2008 | arminski
Hi dave, sorry for my late reply...right now do not have info about the LPI and I'm not allowed to talk to our supplier without going through our sales people...sux! cheers!
Electronics Forum | Fri Apr 25 14:32:08 EDT 2008 | blnorman
Find out what the Tg of the LPI is. Below - rigid, above - flexible.
Electronics Forum | Mon Jul 01 16:15:02 EDT 2002 | Matt Kehoe
We are currently trying to gather information pertaining to applying LPI soldermask thicker than normal. The thick coating is necessary for the SIPAD ssd process however, because of the numerous brands of mask and application methods there is no sing
Electronics Forum | Wed Jun 18 20:27:28 EDT 2008 | davef
No, we not sure if your solder mask is LPI. The article we linked was aimed at solder mask application methods. LPI is the most common mask in use today. So, what kind is it? Green tells you nothing. Solder mask can be a variety of colors.
Electronics Forum | Wed Feb 04 16:33:40 EST 2009 | davef
Your specification for all PCB suppliers of 'solder mask over bare copper using LPI on external layers (green)' is broad and open to the use of material from many possible LPI suppliers by your board fabricator. In at least one case, it appears that
Electronics Forum | Mon Jul 01 20:45:38 EDT 2002 | davef
Solder mask thickness specifications by fabricators are: * Wet mask: 0.0002 ~ 0.0004� on trace * LPI mask: 0.0002 ~ 0.0008� on trace Liquids usually range between 10 to 13 um (0.00039 to 0.00051") when dried. Liquid resist processes I have seen are
Electronics Forum | Fri Jun 09 17:34:08 EDT 2000 | Melanie Mulcahy
I need some information regarding the acceptability/unacceptability of using tented vias with LPI soldermask. Long story on all involved, but basically I have a board that I have had manufactured with no problems which has BGA/uBGA parts, tented via