Electronics Forum: lpi soldermask insulator (Page 1 of 3)

Applying Thicker LPI Soldermask

Electronics Forum | Mon Jul 01 16:15:02 EDT 2002 | Matt Kehoe

We are currently trying to gather information pertaining to applying LPI soldermask thicker than normal. The thick coating is necessary for the SIPAD ssd process however, because of the numerous brands of mask and application methods there is no sing

No-clean, water-based flux residues after wave...

Electronics Forum | Wed Feb 04 16:33:40 EST 2009 | davef

Your specification for all PCB suppliers of 'solder mask over bare copper using LPI on external layers (green)' is broad and open to the use of material from many possible LPI suppliers by your board fabricator. In at least one case, it appears that

Applying Thicker LPI Soldermask

Electronics Forum | Mon Jul 01 20:45:38 EDT 2002 | davef

Solder mask thickness specifications by fabricators are: * Wet mask: 0.0002 ~ 0.0004� on trace * LPI mask: 0.0002 ~ 0.0008� on trace Liquids usually range between 10 to 13 um (0.00039 to 0.00051") when dried. Liquid resist processes I have seen are

Using LPI w/ tented vias

Electronics Forum | Fri Jun 09 17:34:08 EDT 2000 | Melanie Mulcahy

I need some information regarding the acceptability/unacceptability of using tented vias with LPI soldermask. Long story on all involved, but basically I have a board that I have had manufactured with no problems which has BGA/uBGA parts, tented via

White Solder Mask Discolored after Reflow Oven

Electronics Forum | Sun Aug 23 11:42:01 EDT 2009 | ysutariya

Hi Dave, I haven't tried the Probimer yet, but the Taiyo ink didn't hold up too well. As a PCB fabricator, finding a white soldermask that has good trace coverage and survives 4X solder immersion (HASL) is like the holy grail of white soldermask.

Tenting via(s) under BGA & CSP?

Electronics Forum | Mon Apr 22 15:05:47 EDT 2002 | tim_easterling

Depending on the volume of boards you are manufacturing, the most cost effective solution would be to epoxy plug the vias prior to LPI soldermask application. The technique is common practice and most suppliers can provide it will little or no cost a

SMD Adhesives Gluing Process

Electronics Forum | Thu Sep 10 11:47:44 EDT 2009 | mikesewell

The adhesive should be a dielectric (insulator) by design, if not it could possibly short across leads of the very parts it's intended to secure. It normally isn't a concern - what is the surface resistance of your soldermask, bodies of ICs, ...etc.

BGA ball size reliability

Electronics Forum | Fri May 07 16:28:07 EDT 1999 | Andrew Wulff

On 1.27mm (0.050 inches) Standard Ball Grid Array's. The ball size diameter starts at approximately 0.025 inches. If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? This is a known L

Tenting of vias

Electronics Forum | Tue Aug 18 10:18:22 EDT 1998 | Dave Hulbert

I have a question on tenting of vias on PWB's. I have designed a 6 >layer, military, mixed components (all on top side), LPI soldermask >board which will be run over the wave. I was planning on tenting vias >but did not specifically specify that on f

Re: Tenting of vias

Electronics Forum | Mon Aug 31 14:03:41 EDT 1998 | Bill Childs

I have a question on tenting of vias on PWB's. I have designed a 6 >layer, military, mixed components (all on top side), LPI soldermask >board which will be run over the wave. I was planning on tenting vias >but did not specifically specify tha

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