Electronics Forum: m2 vacum problem (Page 1 of 4)

topaz x bring back component

Electronics Forum | Fri May 27 13:20:06 EDT 2016 | elton111

how are you. I have a problem with a table that the issue errori topaz. The issue is the message "Bring back component." a problem with the pick up parts vacum setting level is 100 and the current 111 with vacum head is 6. Can u tell me how to Calibr

Glue Bubbles

Electronics Forum | Thu Apr 08 10:54:16 EDT 2004 | mrmaint

We typically store the tubes straight up and down. This seemed to help with the air pocket problem. Did not solve it 100 percent. best bet is still vacum.

Re: footprint formula

Electronics Forum | Thu Mar 02 11:57:25 EST 2000 | Wolfgang Busko

Did you try the online-calculator at the IPC-page. If you have the datasheet it should be no problem. For wave soldering I can�t tell if it�s suitable for that particular part, but you should add extra pads at the end of each column to solderbridging

Re: footprint formula

Electronics Forum | Thu Mar 02 11:57:25 EST 2000 | Wolfgang Busko

Did you try the online-calculator at the IPC-page. If you have the datasheet it should be no problem. For wave soldering I can�t tell if it�s suitable for that particular part, but you should add extra pads at the end of each column to solderbridging

component aherence force on the solder paste before reflow

Electronics Forum | Mon Jul 02 06:01:22 EDT 2001 | wbu

Well, I�ve never encountered any problems with it. If you use paste in the specified window according time and environment there should be no problem. If you try to measure this force you would IMO check out if you yourself did not treat the paste as

Re: Solder cream kits (flux and powder separately)

Electronics Forum | Fri Mar 03 09:48:06 EST 2000 | Wolfgang Busko

I have heard about it. The main reason is to save money. The problem is, or better is said, that the mixing isn�t that simple for you got have a homogen paste afterwards and the solderballs shouldn�t be deformed in size so that problems during printi

Re: Solder cream kits (flux and powder separately)

Electronics Forum | Fri Mar 03 09:48:06 EST 2000 | Wolfgang Busko

I have heard about it. The main reason is to save money. The problem is, or better is said, that the mixing isn�t that simple for you got have a homogen paste afterwards and the solderballs shouldn�t be deformed in size so that problems during printi

Accuflex MPM X,Y table issue

Electronics Forum | Fri Dec 17 09:49:34 EST 2010 | remullis

Hello to all, I am having problems with the X,Y table initializing. I noticed the Skew motors 17M1 and 17m2 are moving but the table keeps wanting to drive in the left direction standing in front of machine. It will keep trying to drive until it tim

Re: HAL vs. Silver Coated

Electronics Forum | Fri Mar 10 09:01:44 EST 2000 | Wolfgang Busko

Hi John, we had one shot with silver coated PCBs. With "no clean" and no changes in process parameters ( we had no input on necessary changes from the boardhouse ) we encountered wetting problems in the first reflow soldering process. Later it was s

Re: BGA design Guidelines

Electronics Forum | Thu Mar 09 05:44:07 EST 2000 | Wolfgang Busko

Hi Edmund, J-STD-013 "IMPLEMENTATION of BALL GRID ARRAY and other HIGH DENSITY TECHNOLOGY" should be a great help for you. Component manufacturers ( try Motorola via Internet) also give good advice. For the DFM aspects get in contact with your asse

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