Electronics Forum: machine operator (Page 166 of 176)

Re: how to overcome tolerance in automatic alignment

Electronics Forum | Sun Sep 12 08:20:04 EDT 1999 | se

| | | | hi, i m college student. i m currently doing my Final year project in PCB drilling. the main task is to design auto feeder which allign the PCB properly in position before drilling take place. the close tolerance becomes a big problem to the

Re: PCI Press Fit on Daughter Cards

Electronics Forum | Fri Jun 04 14:00:32 EDT 1999 | Arthur Burdick

Wendy, we at ASG make electric presses for press fit connectors, and have made fixtures for AMP Zpak connectors. give me a call i believe we can help. 561-848-6746 Arthur | Wendy.. | | I found that little nugget a good one from my connector supp

Re: Too hot to handle

Electronics Forum | Thu Jan 28 17:37:00 EST 1999 | Earl Moon

| | | | | Greetings, | | | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | | Also, is there any danger of the pcb's giving off some k

Re: Too hot to handle

Electronics Forum | Thu Jan 28 17:37:02 EST 1999 | Earl Moon

| | | | | Greetings, | | | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | | Also, is there any danger of the pcb's giving off some k

Re: Too hot to handle

Electronics Forum | Fri Jan 29 07:55:52 EST 1999 | Wayne Bracy

| | | | | | Greetings, | | | | | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | | | Also, is there any danger of the pcb's giving of

Re: No Clean in High Frequency Apps

Electronics Forum | Wed Dec 09 10:02:10 EST 1998 | Earl Moon

| Does anybody out there have any special insights into utilizing no clean paste in high frequency RF applications? I would imagine there may be some issues with solder balls that would affect functional test (Earl, do you have something for me here?

Re: Re balling BGA

Electronics Forum | Tue May 26 15:05:39 EDT 1998 | Justin Medernach

| | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | Earl Moon | Earl: We send the BGAs to a service "re-baller." Dave F | | PSI, 16833

Re: Re balling BGA

Electronics Forum | Tue May 26 18:24:05 EDT 1998 | Earl Moon

| | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | Earl Moon | | Earl: We send the BGAs to a service "re-baller." Dave F | | | | P

Re: Re balling BGA

Electronics Forum | Wed May 27 11:13:38 EDT 1998 | Justin Medernach

| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | |

Recomendations? Fuji CP7 or Univ HSP4797?

Electronics Forum | Sat May 22 19:02:04 EDT 2004 | Grant

Hi, I had another thread on this, however it's kind of petered out, and so I thought I would start another more specific thread. We have been looking at both the Fuji CP7 and the Universal HSP4797 however really have no idea what to choose. It seem


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