Electronics Forum: machines (Page 1226 of 1642)

AOI vs AXI

Electronics Forum | Wed Jun 12 11:14:57 EDT 2002 | pjc

Sam, Like I said, AOI for pre-reflow inspections is the easiest to program and maintain. Each vendor of AOI has its pluses and minuses for programming and performance. Do a careful investigation of each vendor to learn about their machine performanc

force between the pad and laminate material

Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef

Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1

Tombstoning

Electronics Forum | Sat Jun 15 22:39:05 EDT 2002 | edahi

well we can't paste the flip chip on its substrate because we are using flux...because this bare die yet...and the surface of the die flipped might be contaminated...also after chip attach and reflow the die is to be underfilled and if the die is pas

Amistar Support

Electronics Forum | Wed Jun 19 09:17:21 EDT 2002 | doctord

I am looking to create a "User Group" for Amistar equipment. We are a midwest contract manufacturer with several Amistar placment machines. With the recent departure of Qualmax as an I-Pulse distributor, users in the US are left with few options. I w

Comparison between Glue & solderpaste process

Electronics Forum | Fri Jun 21 12:49:58 EDT 2002 | surinder

Hi Russ, Thanks for your input.My board has SMT Chip components, SOT23,SOIC's & 2QFP (25MIL PITCH). Also,taking consideration that the board is well design for Wave.This board has been designed end of last year. We have latest model of Electrovert ma

Comparison between Glue & solderpaste process

Electronics Forum | Fri Jun 21 16:41:10 EDT 2002 | pjc

If your wave machine has the new style Rotary Chip Wave and the Hot Air De-Bridging Knife options you can expect good yields. However, depending on the PCB design, double-sided solderpaste reflow and selective solder pallets for wave solder is a bett

DoE on post-reflow PCB - warp

Electronics Forum | Thu Jun 27 17:24:17 EDT 2002 | Daan Terstegge

Never did a DOE on that, but I think it would be quite difficult to warp a board inside the oven if it was flat when it entered the machine. If there's no center-board support then it's another story, then the board will bend due to it's own weight.

Mydata software upgrade

Electronics Forum | Mon Jul 01 15:27:37 EDT 2002 | pjc

Upgrading to 1.6 is not going to buy you anything worth the effort. 1.5 to 1.6 is just a software upgrade- no hardware. If you are the original owner of the machine the software is $600 plus cost for field service engineering to install. If you are n

ESD Control Set-up

Electronics Forum | Mon Jul 08 08:31:19 EDT 2002 | davef

Use where operators need to move frquently, say around process machiney, like placement or wave solder machines 2) wrist strap with continuos monitoring => => Use where operators don't move much and the potential to damage product is high, like a han

SMT COMPONENTS

Electronics Forum | Sat Jul 13 21:10:23 EDT 2002 | kenbliss

Can I get some feedback from everyone, I have a few customers telling me they are having a very big problem with components coming into their factory in the wrong type package, wrong tape, Jedec tray instead of tape etc etc. They then resend them ou


machines searches for Companies, Equipment, Machines, Suppliers & Information