Electronics Forum | Sat Mar 06 08:45:16 EST 1999 | Dave F
| I need advise on how can bonding of ICs to flex foil be done. | The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. | | Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), a
Electronics Forum | Mon Mar 08 09:23:02 EST 1999 | Dave F
| I need to attach / assemble Flexible circuit onto Rigid PCB without use of any connectors i.e. fingers / tracks of Flexible circuit are to be attached / directly to the fingers of the Rigid Glass Epoxy PCB. | | I need info on the alternate proces
Electronics Forum | Wed Feb 02 20:43:56 EST 2000 | Dave F
KC: Try: 1 http://www.rogers-corp.com/cmu/techindx.htm Circuit Materials Division Tech Tips Index: Techtip #9: Measurement of Copper Thickness by the Weight Method 2 Andy Magee - Flex Guru Senior Consultant, Bourton Groupmagee@donet.com (937) 435-
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