Electronics Forum | Tue Sep 29 17:02:12 EDT 1998 | Mike Cox
| Just verifying that I can post to the main listing. | | Cliff Wow this is nice, I think the new forum is so nice it calls for a cigar (not the presidential kind) and a round of applause (clap clap clap clap). Mike
Electronics Forum | Mon Sep 28 12:55:37 EDT 1998 | Manish Ranjan
Hi Everyone Does anyone has any insight regarding the void formation in the solderbumps during wafer bumping by electroplating. Someone told me that it could be mainly coz of the alloy concentration being incorrect. Any suggestions, corrective action
Electronics Forum | Wed Aug 05 14:55:15 EDT 1998 | john
Probably should have been more specific. We want to do some stencil etching. Mainly for prototype work nothing too high volume. Thanks, Oh yeah, (Ben) and maybe a tattoo here and/or there.. Ha ha ...
Electronics Forum | Fri Jul 10 14:33:26 EDT 1998 | Bob Willis
There is a training video, CD ROM and technical report on PIHR available from the SMTA Main Office in the USA. Further details are available from my web site if you do not have any luck with the SMTA. | I am looking for infromation on intrusive reflo
Electronics Forum | Tue Aug 28 16:43:19 EDT 2001 | davef
Try: * McMaster-Carr http://www.mcmaster.com/ * Fisher Scientific https://www1.fishersci.com/main.jsp
Electronics Forum | Mon Sep 24 18:00:58 EDT 2001 | jagman
Does anyone know the cause(s) of solder flowing through a via to the other side of board during reflow causing solder bumps on opposite side? Is this mainly a design issue or could it be process related? Any help is appreciated.
Electronics Forum | Tue Apr 23 16:46:14 EDT 2002 | retronix
I would sugest the lowere the baking temperature the better, the main cause of popcorning is the water expansion and this is greatest as the water boils, 100 degrees, better to elongate the time. Matt
Electronics Forum | Fri Mar 08 22:07:31 EST 2002 | winter
I think the reason of the problem is the sensitivity of some sensor.maybe it's the main conveyor arrival sensor .I think you can do a test , make the sensor always on, and tese.
Electronics Forum | Wed Apr 17 11:46:04 EDT 2002 | davef
http://www.fujiamerica.com/Home/main.asp works for me. I found this by searching on ... fuji america ... in http://google.com
Electronics Forum | Tue Jun 25 13:26:53 EDT 2002 | cnotebaert
Inernal use only, mainly for test fall out. We have a 3"x4" tag that gets attached. This tag identifies reason for fail and follows the brd until it is repaired, the tag is then removed and info is logged under the assy p/n & serial number.
