Electronics Forum | Wed Apr 29 10:05:05 EDT 2009 | wavemasterlarry
you have to lots of paste. one makes balls, one doesnt. Then why bake parts to over come bad paste? Sounds like the paste maker mixed the formula wrong on the one lot of paste. I used to work at a paste place and a lot of hand mixing is done at t
Electronics Forum | Tue May 26 10:23:53 EDT 2009 | mun4o
hi, i am proccess eng solder wave process.I have problem with a PCB.There have ceramic SMD capacitor, SMD thermistor and SMD inductor 1uH.After reflow all is OK, but after SW these components are broken???The pin is separated from the body???the que
Electronics Forum | Tue Jun 09 12:35:18 EDT 2009 | jdumont
We have used an Asymtek C-740 for about three years now and its never had an issue even once. We spray Humiseal acrylic so I cant help you too much with the silicone but the machine itself is great. Opt in for the little process control extras lik
Electronics Forum | Wed Jun 24 03:20:08 EDT 2009 | hayee
Hi, I want to make a small setup for manufacturing PCB's based on SMD's for (pototyping boards, etc). I don't know clearly what are the equipments required for this purpose. I have an idea that we have to use (Pick n place station, Screen printing
Electronics Forum | Wed Jun 24 06:49:59 EDT 2009 | vetteboy86
I'm building a clamshell test fixture. I have all the pins and sockets to make a bed of nails. I purchased an enclosure. Everything else is pretty standard. I do not however have any information on pushpins. These would be inserted into the lid, then
Electronics Forum | Thu Jul 23 09:30:22 EDT 2009 | dekhead
It isn't clear if it was working and stopped, or if this is the first time you've tried to make it work. If this is first try, need to confirm cards and cables on DEK, and what interface is configured on UIC. I have SMEMA cards in stock if needed. P
Electronics Forum | Sun Sep 27 17:31:12 EDT 2009 | bandjwet
There are a couple of companies that make BGA > reballing kits. Try: Winslow Automation _a > class=roll > href="http://www.winslowautomation.com" > target="_blank"_http://www.winslowautomation.com_ > /a_ Another alternative BGA reballing kit
Electronics Forum | Tue Jul 28 13:27:31 EDT 2009 | davef
It's possible that there is limited application of "3M™ XYZ-Axis Electrically Conductive Adhesive Transfer Tape 9719" similar to your intended use. What do 3M™ application types say? Certainly high temperature soldering would make a mess of a piezoc
Electronics Forum | Thu Aug 06 14:58:40 EDT 2009 | davef
Semiconductor fab back-ends and production contractors use laser assisted solder jetting for protoyping, repair, and other low volume flip chip bumping. * As you say, printing paste is going to be very tough to control. * Solid ball placement is ai
Electronics Forum | Tue Aug 25 10:25:56 EDT 2009 | grahamcooper22
Do you know the exact BGA sphere alloy make-up and the alloys melt temp ? Then you can judge the ideal reflow temperature. Also, does the package warp in the reflow zone ? This may be causing the solder spheres on the BGA to lift off the pcb and henc
