Electronics Forum | Mon Jun 08 16:20:43 EDT 1998 | Earl Moon
| | How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can
Electronics Forum | Mon Jun 08 07:49:40 EDT 1998 | smd
In our continued search for another flex machine, we reconsidered Philips Emerald (low Vol/high mix Mfg). We already have a CSM so it makes a little sense. Then the salesman started talking about the Topaz. The Topaz supposedly is "practically the sa
Electronics Forum | Sat Jun 13 07:23:18 EDT 1998 | Dave F
| In our continued search for another flex machine, we reconsidered Philips | Emerald (low Vol/high mix Mfg). We already have a CSM so it makes a little sense. Then the salesman started talking about the Topaz. The Topaz supposedly is "practically th
Electronics Forum | Sun Jun 07 02:06:26 EDT 1998 | Earl Moon
| Earl, | As always, I am interested in what you have to say, but I am still a little vague on your application of ANSI Y14.5 as it relates to the manufacturability of an assembled printed circuit board. Are you implying that component placement coor
Electronics Forum | Thu Jun 04 11:09:50 EDT 1998 | Justin Medernach
| I have gold fingers that I want to mask when running over the wave without pallets. They're on the leading edge of the board. I recall seeing rubber boots that slid onto the fingers to mask them. Pop 'em on before the wave; pop' em off after and
Electronics Forum | Thu May 28 22:49:32 EDT 1998 | D. Lange
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Thu May 28 08:56:12 EDT 1998 | Earl Moon
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Fri May 22 22:18:18 EDT 1998 | David Newman
Hello, I am looking for suggestions for cleaning pcb's after the routing (fabrication) process. Keep in mind that these pcb do not have components intalled on them yet. We have considered pre-drilling the routing plunge points, but cost and capacity
Electronics Forum | Tue May 26 13:04:08 EDT 1998 | Gary Simbulan
| Recently there was a thread on soldering paladium leads on ICs. A gent from TI suggested an article he had written. Various folks suggested making sure the reflow profile peaked above 215C. | My question is: How does one recognize paladium leads
Electronics Forum | Thu May 28 22:02:09 EDT 1998 | Ian Bates
Jerry, I have been using the QP in a Proto and Production environment for about a Year and once the PD is Created(which may take some time) and vision processes. I rarely ever need to make further changes. As far as BGA Pd's. They are a Little
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