Electronics Forum: making (Page 641 of 830)

Intermetallic formation

Electronics Forum | Wed Oct 10 20:58:30 EDT 2001 | davef

Several points are: * There�s quite a bit of background on IMC in the fine SMTnet Archives. I�ll try not to duplicate it. * If you have a smooth and well-formed solder connection using fairly common materials, you assuredly will have IMC. Any evide

Placement Program Tweaking

Electronics Forum | Wed Oct 17 03:24:25 EDT 2001 | djarvis

Dave, Like everyone else,I don't generally allow it. If only one component is off and that head is doing another component of the same type with no probs, ( pick-up is OK ) then I just say "don't ask me - move the bloody thing". I usually find it's

Problems with TI DSP modules

Electronics Forum | Wed Oct 24 11:14:44 EDT 2001 | Cemal Basaran

Dave; Thanks for responsding so fast. here are my answers. 1-WOW!!! How do people get these cool toys? I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the

Adhesive Dispense Equipment

Electronics Forum | Sat Oct 27 12:01:32 EDT 2001 | Stefan Witte

Most of the machine suppliers Fuji, Siemens, Universal and Panasonic did regret that they were building glue machines. Applying adhesive compared to placing a component looks so simple, but it is not and the defect rate is higher than placing 1206 c

Engineering Change Notification - Required Timeline?

Electronics Forum | Fri Apr 05 01:52:34 EST 2002 | djarvis

Huh, what, geez. Wazza time Jimbo? Call me a cab. Why is this gentleman retroflecting? Why would anyone make an articulatory gesture by turning the tip of the tongue back against the roof of the mouth? I don't know what this is a bout, but I can a

Downtime Calculation

Electronics Forum | Sun Aug 18 06:23:34 EDT 2002 | bentzen

Hi Ken. It's always fun and a good exercise to debat on a interesting subject like this. I can see at your response that I have to clarify some of the issues. Yes, the placement machine should be the line bottleneck. And in a line with more placem

Electroless Nickel without gold immersion

Electronics Forum | Tue Aug 20 18:15:02 EDT 2002 | davef

Haaaaa!!!! Soldering to plastic!!!! An apt analogy!!! I like to compare it to soldering to dirt. Some thing. In fact, you are soldering on nickel, when soldering on many things. It�s just that the gold, er Pd, flash enables the wetting mechanism

Cleaning after repair.

Electronics Forum | Thu Jan 23 20:57:33 EST 2003 | davef

If the flux was not activated (ran in another area of the board), the flux should be removed from the board. Any Comments? A: We agree. In order for its �benigness� to take effect, NC flux is affected by: * Type of flux * Amount of flux * Proper ac

Checklist

Electronics Forum | Wed Feb 26 21:38:08 EST 2003 | jonfox

1. First and foremost is paste alignment. If you start out of the gates with a bad paste/pad relationship, it will be nothing but problems down the line. AOI is not required, but dial in the alignment, QC if necessary, then introduce the boards to

Manufacturing breakthroughs?

Electronics Forum | Wed Sep 03 00:25:24 EDT 2003 | severs

I was recently approached by a leading industry consultancy group and was asked, ..."if there have been any major advances or developments in the field of electronics production, what are they?" It got me to thinking, we've certainly witnessed some


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