Electronics Forum: making (Page 76 of 830)

Re: flux compositions

Electronics Forum | Tue Aug 22 16:51:04 EDT 2000 | Dr. Ning-Cheng Lee

Yes, no-clean is more of a challenge, particularly for halide-free no-clean. Requirement on probe testability will make it more difficult.

Re: Industry Challenges

Electronics Forum | Thu Jul 20 14:25:03 EDT 2000 | Bob Willis

Better design for manufacture Better education for engineers in manufacture at college and university Realising that there is just so far you can push FR4 laminate Finding a way of making all the knowledge in our industry available to those future en

Inspection Machine Capability

Electronics Forum | Mon May 07 16:41:55 EDT 2001 | davef

Automatic optical inspection machine suppliers seem to tailor their machines for different tasks [eg, paste inspection, component ID & positioning, reflowed solder quality]. Is this observation accurate? If not, why? If so, what characteristics of

Matrix Tray Holder

Electronics Forum | Wed May 09 11:13:58 EDT 2001 | davef

Hold it!!! Call Bob over at Tri-Metal Fabricators and ask him to make you one for about 10% of the price a fine OEM would charge. Might not a a fancy anodized finish, but at the end of the day, it'll hold yer trays just fine.

Removal of screening cans

Electronics Forum | Wed May 23 02:45:37 EDT 2001 | johnluckham

I am looking for a way of removing screening cans from a PCB without reflowing the components siyuated under the can. I remember HP use to make a laser that could be used for this job, had anyone got, or had experience of this problem.

No clean flux residue

Electronics Forum | Mon Jun 04 07:38:26 EDT 2001 | hussman

Ummm...Ok? Lumidor, The best thing to do is find out at which process this "wax" is occurring at. Targeting the process that just changed may be presumptuous on your part. Pick up the phone or make a visit. In either case, you're the customer a

Standarized Part Descriptions

Electronics Forum | Tue Jun 19 18:18:31 EDT 2001 | davef

You can make this as complicated as you'd like. Look at: http://fcim.dscc.dla.mil/Programs/MilSpec/default.asp?DocTYPE=PRF

MS Level 6

Electronics Forum | Thu Jun 21 20:54:27 EDT 2001 | davef

Possibly, let me think through this. I always thought it was the original tile, after you re-tiled. Yeth, that makes it the under the floor one!!!

component aherence force on the solder paste before reflow

Electronics Forum | Mon Jul 02 04:06:07 EDT 2001 | chinaren

Hello: Did anyone make some tests to show the adherence force between placed components and solder paste before soldering? and is there anyone who measure this adherence force during production?and any benifits fromthis activity? Thanks with best re

solder balls

Electronics Forum | Wed Jul 18 02:05:30 EDT 2001 | winnifred

Steve, To clean the RMA processed boards, u hv to make sure u talk to the supplier first, then get the right saponifier and do semi-aqueous cleaning.


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