Electronics Forum: mani (Page 366 of 496)

Line release of post reflow AOI and AXI

Electronics Forum | Tue Sep 16 19:16:11 EDT 2008 | hegemon

Hello everyone! > > I'm a student of electrical > engineering currently working on a thesis for my > BSc degree. It will be about post reflow AOIs and > AXIs, and I'd kindly like to ask you for some > help with it. > > I would like to know if t

First time Pick and Place Machine

Electronics Forum | Fri Jul 21 09:23:05 EDT 2017 | sumote

I am not going to give you any names of equipment manufacturers as I believe most people tend to recommend only what they are familiar with. I have my favorites as, likely, most everyone else does as well. What I will tell you is equally important.

Selecting pick and place machine (comparison/personal experience/sales pitches)

Electronics Forum | Fri Apr 30 10:42:40 EDT 2021 | oxygensmd

I have a customer who ask close to prototyping jobs with low volume and high-mix components. A regular job have around 5-30 pieces board but have high quantity and many type of components. All the time over 1000 pieces of parts on board from 250-350

Re: Farewell to fellow old-timers and up-and-comers alike

Electronics Forum | Thu Feb 17 10:38:46 EST 2000 | Keith Luke

Scott, We always regret to see a dedicated user leave the fold. Over the past few months we have made many changes to the site, and we believe, improved the quality of the forum experience for our users. During our recent site upgrade we respond

Re: CPH

Electronics Forum | Thu Feb 10 15:26:57 EST 2000 | Dean

Simplify. FInd your botle-neck process (use a stop watch). You assume it is a P&P machine...(it could also be print or glue etc.) Your only concern is that bottle neck process and how many parts / hour that process can deliver. That is your gatin

Spray Fluxing

Electronics Forum | Thu Jan 18 04:30:52 EST 2001 | johnwatt

Ok so for me, spray fluxing is the way to go every time....for one you don't need to worry about colapsing your foam with pallet's that are hot or worrying about your pummace, your thinners, SG and so forth...man life in foam fluxer land was hard. N

Re: BGA coplanarity

Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette

John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th

Immersion Silver - Sulphur

Electronics Forum | Sun Feb 23 14:32:42 EST 2003 | davef

Sources of sulphur in PCB fabrication are: * Some locales have high H2S concentrations in the air. * Metal etching steps that use sulfuric acid or a sulfonated buffering compound may result in sulfate residues. * Sulfates can come from contact with

Re: Quantity of dross and type of flux

Electronics Forum | Tue Nov 21 22:15:59 EST 2000 | Vince Whipple

Mohammed, The first suggested place to start with your question would probably be with your flux Mfr. Push them! The quantity of dross is effected by several factors: The higher your solder pot temp., the higher your dross level... but don't go too

Your next plant

Electronics Forum | Mon Nov 06 12:01:47 EST 2000 | Chad Pawlak

Late last week 10% of the population of Thorp, WI lost their employment. Saputo Cheese of Montreal Canada, formerly Stella Foods and formerly Blue Moon Cheese announced it will shut the doors to this 70 year tradition on Jan 3. Leaving in its wak


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