Electronics Forum | Sat Aug 07 11:33:55 EDT 1999 | JohnW
| | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usually pu
Electronics Forum | Fri Jul 30 10:30:23 EDT 1999 | Wolfgang Busko
| | | While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That w
Electronics Forum | Fri Jul 30 16:06:22 EDT 1999 | Earl Moon
| | | | While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That
Electronics Forum | Tue Jul 27 17:54:37 EDT 1999 | Earl Moon
| | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | 12BGA per assembly | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | Pads .014inch | | | | | Vias within footprint .020inch | | | | | Vias to
Electronics Forum | Thu Jul 29 11:34:27 EDT 1999 | Justin Medernach
| | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | 12BGA per assembly | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | Pads .014inch | | | | | | Vias within footprint .020inch | | |
Electronics Forum | Thu Jul 29 15:29:30 EDT 1999 | Earl Moon
| | | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | | 12BGA per assembly | | | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | | Pads .014inch | | | | | | | Vias within footprint .02
Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon
| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |
Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin
| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |
Electronics Forum | Fri Jun 18 15:04:19 EDT 1999 | Scott Cook
| Scott, | | I do hurt easy. Be gentle, at least that's what I tell all the women in my life though quickly diminishing supply - oops. I do not happen to believe this statement. I have seen you dodge many a penned "dart" on this very forum. Since I