Electronics Forum: manufacturing (Page 206 of 636)

Tombstone caused by flux residue

Electronics Forum | Thu Jul 07 04:34:19 EDT 2005 | Lloyd

This problem exists at a very low level but happens on all our discrete components, all our products and in two plants. Between the PCB land and the component termination there is a barrier of flux residue, this actually lifts the component slightly

smt production

Electronics Forum | Wed Jul 13 14:50:29 EDT 2005 | rameshn

Dear Sir, We are manufacturing Computer Motherboards & Networking products (which are having 2 to 3 BGA Chips onboard) in our plant. we are having 2 nos of HELLER 1800W model Reflow Ovens. this model reflow oven is having 9 heating zones at both top

SMT PICKN'PLACE

Electronics Forum | Mon Jul 18 01:23:23 EDT 2005 | Cal

In regards to your post...I am sure Autotronk is the manufacturer. I can only asume when you speak of a "local Rep" it is in the US. If you go to Autotronik's website via the link you provided...you will see Manncorp is the Canada/USA/ Mexico Rep. He

Reflow Oven Selection

Electronics Forum | Fri Sep 02 11:44:59 EDT 2005 | Brian

We (ETS) are a manufacturer of reflow, curing and preheat systems and have had similar requests from customers in the past. One in particular required soldering onto an aluminum heat sink weighing approx 5 lbs. You might consider selective/robotic so

Is there any formal school or training for SMT?

Electronics Forum | Wed Oct 19 07:30:25 EDT 2005 | davef

Try: * Electronics Manufacturing Productivity Facility (EMPF) 317.226.5640 Ray Cirimele 317.231.2045fax226.5673 * National Training Center for Microelectronics Northampton Community College 3855 Green Pond Rd Bethlehem, PA 18017-7599 610.861.4553f

Fine Pitch Stencil Design

Electronics Forum | Wed Dec 14 07:38:56 EST 2005 | tk380514

the original question was: Please give me some guidelines on designing Stencils for Fine Pitch. which i did however, 40% fallout for solder shorts this could be caused by many other processes having gone wrong before, i.e. type of solder paste

Lead-Free Bom Conversion (please read)

Electronics Forum | Mon Feb 13 15:01:37 EST 2006 | Brian W.

We have a joint process with our purchasing department. They get notification from a supplier, which is passed to us. As a CM, we notify the customer and get permission to use it. Then we enter a new part number with a special suffix indicating le

Reduced component lead diameters

Electronics Forum | Wed May 03 12:26:30 EDT 2006 | patrickbruneel

This is indeed yet another proof that under impulse of the RoHS directives all norms are flushed down the drain. Bean counters are slowly but surely taking over our industry because they no longer face resistance by form of standards. Even the basic

Mix Pb and Pb free alloy

Electronics Forum | Thu May 25 11:31:52 EDT 2006 | muse95

Patrick, I believe you are mistaken about this being a myth. Many component manufacturers changed more than plating to make their component withstand higher temps. Some changed mold compounds, others changed plastic types used. Many of these change

MC33982PNAR2 (aka PC33982BPNAR2) PQFN

Electronics Forum | Fri Oct 20 11:23:33 EDT 2006 | mmjm_1099

Good morning/afternoon/evening everyone! I am seeking the assistance/guidance of anyone who has had practical experience with placing, soldering, and rework of this particular component. One of our customers is looking to use this component on quit


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