Electronics Forum | Thu Jul 24 00:39:40 EDT 2003 | MA/NY DDave
Hi, If the failure rate is a lot higher than all the other components including ones similar to the 0603's than you won't be making a big deal. It is all relative. My only thought is to run a DOE with 0603's from different manufacturers and see if
Electronics Forum | Tue Sep 23 17:52:12 EDT 2003 | lysik
I work for a large Contract manufacturer. We use Fuji Siemens and Universal. Universal is by far the most stable reliable system. They always have the parts in stock we need. Great support. Samsung has now pulled out of direct sales in the US. I woul
Electronics Forum | Thu Aug 07 16:52:49 EDT 2003 | craigj
We've been doing it for quite a while on some parts but are noticing that as more manufacturers are going lead free we are starting to see some issues. Particularily with pure tin on nickel. Have found that need to increase oven reflow temp and time
Electronics Forum | Mon Aug 11 15:57:18 EDT 2003 | Fred Matthews
As the traqnsistion to Pb free manufacturing gains speed and exposure the period between true Pb free solutions and the present is still somewhat distant. Are there any publications or documentation on the use of Pb free components and non-Pb free
Electronics Forum | Fri Aug 15 01:31:17 EDT 2003 | Jay
Hi All, I work for a contract manufacturing and we are having a new PCB to build. The PCB has OSP coating on it and it has been sitting open in the production floor for about 15 days. I am not sure weather it will affect the soldering process or not
Electronics Forum | Tue Aug 19 11:31:43 EDT 2003 | davef
JEDEC standard EIA/JEP124 Section 5.2.1 Packing Moisture-Sensitive Components has words to the effect: "...Partially or lightly evacuate the bag to reduce packaging bulk and heat seal the bag as close to the end as possible following the heat sealing
Electronics Forum | Tue Aug 26 21:20:58 EDT 2003 | iman
You may check with the TDS of respective "active parts" IC manufacturers for their recommended no. of thermal cycles permissible in the reflow process. Last I checked 3 cycles for our RF-apps IC was still allowed. For 48pin-QFPs this can be allowed
Electronics Forum | Thu Aug 21 18:36:32 EDT 2003 | paulm
Hi Dave and Justin, Thanks for the advice. Dave you mentioned you "smush" your bga's. What type of machine are you placing then with it? Is the additional pressure to smush them machine or manually applied? Also, the 0.004" variance we are being
Electronics Forum | Tue Sep 09 00:51:33 EDT 2003 | iman
everyone made good observations in the arena of improvements. being rather pessimistic today, I'd like to say the one core area of little (if none at all) improvement is the over-reliance of human (aid/non-aid) inspection of SMT output soldering de
Electronics Forum | Thu Sep 11 18:45:56 EDT 2003 | russ
Why/how are they getting mixed up? You should figure that one out and fix it. As far as some type of coding, I believe that the supplier of the part would have to do that in there manufacturing process. You can "light them up" with an appropriate p
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