Electronics Forum | Mon Oct 20 14:28:09 EDT 2008 | jdumont
Yup, just read that in the link Patrick sent. Thanks again... Im going to have everyone screen the boards for this carefully before processing. I have also sent the board manufacturer an email to get their comment on the matter. No PCB vendor thinks
Electronics Forum | Thu Oct 23 21:15:15 EDT 2008 | ikonify
Has anyone been using the following documents for DPMO and any feedback on them? IPC-7912 - Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies IPC-9261 (In-Process DPMO Estimated Yield for PWA) Also is there any databases rea
Electronics Forum | Fri Nov 21 02:10:08 EST 2008 | alan5969
My name is Yuan, i am tech support from Lucida Technology Co Ltd. Our current product is thin client. As our businesses grow, we are looking for Contract Electronics Manufacturing Company or factory to taking over our SMD, assemble and testing to fi
Electronics Forum | Thu Nov 27 20:10:34 EST 2008 | alan5969
My name is Yuan, i am tech support from Lucida Technology Co Ltd. Our current product is thin client. As our businesses grow, we are looking for Contract Electronics Manufacturing Company or factory to taking over our SMD, assemble and testing to fin
Electronics Forum | Thu Dec 04 10:26:06 EST 2008 | billmeye
Is anyone aware of any white papers regarding the possibility of lead contamination on ROHS assemblies from using the same test fixture with the same test probes on both tin/lead and ROHS assemblies. We have customers switching over but we are still
Electronics Forum | Sun Dec 14 03:45:36 EST 2008 | fastek
You still have the same problem........who is going to train you and support it when it needs service? The end user you bought it from? Even the manufacturer will probably not support you if you purchased a used machine without paying them a registra
Electronics Forum | Mon Dec 22 14:15:41 EST 2008 | ck_the_flip
As Emil says, it's 100% the glue! Your paste is not designed to hold parts on at wave solder. Reflow is MUCH hotter than glue, so I doubt you're not adequately heat-curing it. Possibly, the glue cure is "too hot" and maybe making the material brit
Electronics Forum | Fri Jan 09 08:20:43 EST 2009 | caerleon
Does anyone have design knowledge of why some manufacturers remove solder resist from the area around pads on fine pitch devices? What purpose does it serve? I only know that it would be better for AOI as you would not have light being reflected fro
Electronics Forum | Wed Jan 21 03:09:56 EST 2009 | lkpdsund
I totally agree with Wolfman. I recently had the SMA responsibility for a new product from a new customer. The PCB had 600+ mounting positions. It took me almost two days insering them into the part library because an unusual number of the positions
Electronics Forum | Thu Jan 15 12:32:08 EST 2009 | vleasher
After doing some more research it looks like Loctite made a material called Cornerbond 3515 that seems as if it has the characteristics we are looking for such as curing after the solder is liquidous. But it appears that it isn't manufactured anymore
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