Electronics Forum | Mon Nov 17 09:47:25 EST 2008 | cisridn
I would not recommend doing BGA soldering with only a hot air gun. I have done it in the past, but the boards would eventually come back from the field because the solder joints did not form correctly and the BGA would have to be reworked again. I
Electronics Forum | Wed Jan 07 12:42:19 EST 2009 | dyoungquist
We are a small (18 employees) OEM company who also provides EMS to other local companies in our area. Q3-Q4 2008 we did see a small downturn in our OEM sales. Our EMS side actually stayed pretty flat over that same period. Like rob, we have a high
Electronics Forum | Fri Feb 06 15:12:51 EST 2009 | ccross
You need to base your costs on your labor and overhead rate as well as how much your other expenses are(selling, admin, etc) and profit you want to make. For example (let's use nice round numbers) if you place 10,000 parts per hour and your labor an
Electronics Forum | Wed Feb 04 03:20:05 EST 2009 | smartasp
Hi All Reflow Gurus I have learnt that my process engineers do not consider the heat resistance, of the components when creating a reflow profile but rather try to stick to the paste recommendation. This has lead to a field recall as one component h
Electronics Forum | Tue Feb 10 21:12:08 EST 2009 | smartasp
Dear ALL Thanks for the valuable input so far. The solder results is the first priority whereby the solder paste requirements sets the guidelines for the profile first. We use Kick profiler with the latest software. We verify the oven temp and dist
Electronics Forum | Fri Mar 13 11:55:23 EDT 2009 | boardhouse
Hi GSX, just and FYI on why you are seeing a difference per lots. Carbon Ink is Not used on a steady bases by most manufactures, and shelf life of the Carbon ink is fairly short, my guess is what they are doing is adding thinner to the carbon ink t
Electronics Forum | Fri Apr 10 07:52:16 EDT 2009 | davef
On cure checking, we have this undated note from Jack Crawford at IPC * IPC-SM-840C "Qualification and Performance of Permanent Solder Mask" has several Test Methods for different types of solder resist material, but probably the only applicable one
Electronics Forum | Tue Apr 28 08:51:35 EDT 2009 | davef
This is a snip from an ealier post here on SMTnet. Generally, solder pastes are comprised of: 90% solder powder, 5% flux, 4% solvents, and 1% activators [by weight]. Where: * Solder powder, when reflowed, is a metal bonding agent that mechanically
Electronics Forum | Thu May 14 15:51:24 EDT 2009 | dnachristen
I've gone round and round on this very subject with our manufacturing engineer. He prefers to use panel fiducials and I prefer board fids. I've seen the result in placement from bowed PCB's in the machine. Skewing the board a fraction will throw off
Electronics Forum | Tue Jul 14 18:42:41 EDT 2009 | anndi
1smtdude, I interested in your explaination of > re-work an underfill part. You mention the > material can be heated to a plastic state to > become vicious... do you know usually what range > is the temperate? (guess it can depend on the > type
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