Electronics Forum: materials (Page 221 of 345)

Re: measuring board/assy cleanliness

Electronics Forum | Wed Oct 18 16:33:26 EDT 2000 | Dave F

Mike: An omega meter has very little to do with ion chromatography. * IPC TM-650, 2.3.25B, Detection and Measurement of Ionizable Surface Contaminants is a process control method that washes boards with an isopropanol / water solution and measures

Re: How to convince management on buying Equipment ? ---For Dave F, Wolfgang, Moonman and the rests!!!

Electronics Forum | Tue Oct 03 16:56:32 EDT 2000 | JAX

Not sure if I agree with your justification but I might need to read it a few more times to figure it out. I agree that aquiring a dispensing machine is is a good purchase. Maybe you should let him in on the material savings. How many adhesive stenci

Butt-joints

Electronics Forum | Wed Sep 13 14:55:58 EDT 2000 | Mark S

Hi All -- I have read the IPC acceptability requirements of butt-joints, but haven't seen anything on how they're actually performed. I'm assuming we can trim a DIP package, and place the part onto paste immediately before relow (or hand-solder it l

Re: After PCB CLEANING with acqueous , drying needs?

Electronics Forum | Tue Sep 05 16:04:43 EDT 2000 | Dave F

Pascal: Responding to your questions: 1 Do we have to dry the PCB after cleaning (sic)? Generally, nothing says you have dry the PCB after aqueous cleaning. Along this line, I received several thoughtful responses when I posted a similar thread.

Re: ARE ARE ANY REASION IN DELAMINATION OF SMD (QFP)EXCEPT HUMIDITY

Electronics Forum | Mon Aug 21 12:08:36 EDT 2000 | Dason C

Hi! I had experience with my customer complain about the delamination on BGA. The first question, I will ask my customer how they removed the parts and de-cap (my customer is using de-cap instead of SEM, I prefer SEM). Most of the customer which I

CBGA CTE Mismatch

Electronics Forum | Thu Aug 17 22:22:29 EDT 2000 | C.J. Long

Hi erverybody: I am from a PCB shop. One of our product is with 19 X 19 ceramic BGA and my customer is experiencing 0.1 - 04 % failure of open trace on cornoer BGA pad. Substrate is FR4 with TG 135 degree C and delta Tg is well below 3 degree C. Tra

Re: If Not Gold Then What

Electronics Forum | Mon Aug 21 20:25:19 EDT 2000 | Dave F

Doug: I guess every solderability preservative has it�s fans. You know what the issue is? � A supplier that makes it�s customer happy by doing a good job processing material!!!! I�m a HASL guy myself � too much heartache with the other stuff. Giv

Re: Paste-in_hole and CTE

Electronics Forum | Fri Jul 28 14:34:13 EDT 2000 | Gary Simbulan

Belive it or not, these boards were run through a Centech batch mode Vapor Phase machine. Single stage top side IR preheat. Vapor temp 218 C. Solder paste is an SN62 RMA.The boards were FR4 8 layer w/ solder mask, fairly conventional as might be e

Re: Underfilled CSP mechanical test

Electronics Forum | Mon Jun 19 21:32:15 EDT 2000 | Dave F

Frank: Good luck on finding a specification. The right combination of material properties will greatly improve the lifetime of your flip chip component. Your flip chip supplier might be best starting place to determine underfill properties that ma

Re: Curing of Glue for SMT Components

Electronics Forum | Sat Jun 17 09:09:15 EDT 2000 | Chrys Shea

Contact the adhesive manufacturer, or their website. Most adhesive suppliers offer two cure options - one with a belt oven profile and one with a box oven profile. The belt oven is usually a ramp and plateau of 120-150C for approx 2 minutes. The b


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