Electronics Forum: matsu (Page 1 of 1)

non-wetting

Electronics Forum | Tue May 21 06:33:37 EDT 2002 | hayashi

*the other components are 0402 and SOIC 16, the > solderability were good. *the protection on the > terminations of microleadframe package is > Cu(copper),somebody call that leadless leadframe > package(LLP). *the time above 210 deg C is about

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