Electronics Forum | Thu Dec 21 04:27:31 EST 2000 | teohbengee
Need help urgently. Anyone can provide me some information or site on reliability test on PCB assembly like solder joint or anything. Some test like ERSA Test, SHMOO Test, Pull Test, Temperature cycle and humidity Test, vibration Test or any related
Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef
First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us
Electronics Forum | Sun Jun 30 20:00:56 EDT 2002 | redmary
the SOIC encounter solder crack after reliability test, the common process is: SMT---manual soldering---IPT(in process test)---potting---T/C(thermal cycling,only add current and voltage)---B/T and F/T (burn in and functional test). the condition is 2
Electronics Forum | Tue Aug 19 03:35:26 EDT 2008 | dlocampo
But the problem with flying probe is the cycle time. I'm not sure if there is a flying probe out in the market today that can match the cycle time of the conventional bed-of-nails ICT.
Electronics Forum | Thu Feb 03 21:17:07 EST 2000 | Dave F
AF: Unfortunately, there is no "acceptable number of cycles" either in air-to-air and one liquid-liquid thermocycling, nor interconnect stress testing. There can be a "minimum threshold" that would assure no failures as the result of the assembly p
Electronics Forum | Thu Mar 19 02:35:48 EDT 2020 | franknguyen
Hi, I got a new project, and need to provide customer the ICT (In-Circuit-Testing), FPT (Flying-Probe-Testing) process quotation. The new PCBA contains analog components, digital components, and some BGAs that can support Boundary Scan. Does anyone
Electronics Forum | Tue Jan 05 10:17:25 EST 1999 | Earl Moon
| | | Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be
Electronics Forum | Mon Jan 05 00:30:07 EST 2004 | Arthur Yang
Hi you there, Do you have any experience upon the shelf life of PCBA which passed 100 cycles of liquid to liquid thermal stress test, 125 to -35 centigrade for 15 minutes and 5 seconds of transfer time from 125 to -35 centigarde. Will apprecia
Electronics Forum | Fri May 31 05:54:09 EDT 2019 | dhanish
What are the common cause for solder joint crack after the pcba go through Temperature cycling test ?We have seen failure on solder joint for the memory part.
Electronics Forum | Tue Nov 25 16:26:43 EST 2003 | tdurston
We are trying to establish requirements and process controls for completed, cleaned SMT assemblies. We have problems with our high impedance circuits (100 meg ohms) being affected by residue. Some boards require additional cleaning cycles to remove
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