Electronics Forum | Thu Mar 27 08:05:20 EDT 2008 | davef
Search the SMTnet Archives for threads like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=6753 where J Medernach says, "Make sure your supplier uses some sort of process control of coating thickness. If they don't have a photospectromete
Electronics Forum | Thu Apr 24 20:52:03 EDT 2008 | davef
Use of a hot air gun to reflow solder that passes tests [after failing those tests] seems to indicate the standard process reflow was inadequate. To understand this better, we'd want to measure temperatures at various points on the board during reflo
Electronics Forum | Thu Apr 24 21:52:18 EDT 2008 | fowlerchang
We have measured the temperature of CSP solder joint. The peak temperature is 232oC and the wetting time above 217oC is 30s. But we use leaded solder paste instead of lead free solder paste. I doubt why no crack of solder joint was observed after cr
Electronics Forum | Tue Jul 29 08:29:21 EDT 2008 | davef
Beyond the materials cost, one approach to estimating the cost of assembling a board is: 1 Direct cost * Determine the processes required to assemble the board * Separate parts on BOM according to process * Multiply number of parts in each process by
Electronics Forum | Mon Aug 11 04:08:52 EDT 2008 | janet200701
we want to estimate the price of assemblyng a > board that contain both SMD and THT component . > and also we have the BOM file of this board . > please help me There is 3part on the cost: 1. PCB cost 2.Assembly cost 3.components cost. If you w
Electronics Forum | Thu Aug 14 07:42:28 EDT 2008 | davef
You can assess these costs anyway that makes sense to you. These machinery costs are 'direct' to the product. You could call them manufacturing overhead or machine cost. It all depends on what makes sense. As an example, depending on the products you
Electronics Forum | Wed Jul 30 16:57:23 EDT 2008 | stevek
Folks, I'm looking for some specs for the maximum bend or strain that should be put on a PWB. Not looking at the solderjoints. I'm concerned with localized bending of the fab and what might be a reasonable limit for that bending. I've measured 105
Electronics Forum | Fri Sep 05 10:31:22 EDT 2008 | realchunks
Without knowing your board, oven or profile, I would suggest working the middle of your profile. Try a slower conveyor speed to increase your soak zone of your profile. This will decrease your delta-T across the board. You may also have to work on
Electronics Forum | Tue Sep 16 08:02:15 EDT 2008 | cyber_wolf
OEE is something that is difficult to project, because there are many factors that effect it. Component replenishment, change-over times, programming issues etc. I am sure the Fuji applications folks would be happy to figure out how many modules you
Electronics Forum | Wed Oct 01 10:57:53 EDT 2008 | blnorman
Oxford Instruments makes a device called the OSPrey 800 that measures OSP thickness on the pads. We took a look at it last year because we have one line that uses OSP. It is pricey, and that's why we didn't order one, but if you use a lot of OSP, m
.gif)
