Electronics Forum | Mon Feb 03 20:23:48 EST 2003 | davef
Use the pad mating to lead wetting area. Check: * Phil Zarrow's site [ http://www.itmconsulting.org ] for a paper. * Bob Willis may have something on his site [ http://www.bobwillis.co.uk ]. He has been very involved in developing this measure. * F
Electronics Forum | Wed Feb 05 11:38:46 EST 2003 | Stephen
Don't forget placement. I"ve seen chips broken when they are being placed because they were thicker than the parts data used for them. This is not an issue on Panasonic machines because they measure the thickness of parts but I have seen it happen
Electronics Forum | Thu Mar 27 14:09:41 EST 2003 | Enrique Chairez
Hi All, I have observed this problem with one PCB supplier, the portion of the PCB area affected was cut and observed in SEM (Scanning Electron Microscope) and submitted to an EDX (Energy Disperse X ray analysis), finding Phosphorus levels higher
Electronics Forum | Tue Mar 04 17:47:19 EST 2003 | msivigny
Hello EW, thanks for your input, the data collection for measurements such as these can get confusing because you're calculating deviations from set point location to actual placement location and then analyzing the full result. Then there are many o
Electronics Forum | Wed Mar 05 11:54:44 EST 2003 | ruggi
Hi JFB, I think this is an unnecessary activity, but it may depend on your RH. We are in the Spokane, WA area, and the RH avg year round is about 25-30%. We have never baked our PCBs in the 9 years I've been here across 800+ varieties, including
Electronics Forum | Fri Apr 11 16:07:08 EDT 2003 | daanterstegge
I'd say your profile is about right, assuming these are values that you measured in the balls of this BGA and not elsewhere on the board. If you want a more shiny joint than use a nitrogen oven or experiment with various solder pastes, but why the he
Electronics Forum | Wed May 28 14:35:47 EDT 2003 | davef
Wow, you're very correct. I guess we use silicone to calibrate our machine, as follows: XPS spectral measurements of dimethyl silicone should include O(2s) at 25 eV, Si(2p) at 102 eV, Si(2s) at 153 eV, C(1s) at 285 eV, and O(1s) at 533 eV. The C(1s
Electronics Forum | Thu May 29 08:28:16 EDT 2003 | davef
Teradyne says, "How does one evaluate the competency of a particular AOI system? At the highest level, all potential customers must judge any viable AOI system using the following qualities: * Throughput must be able to match the line rate on the man
Electronics Forum | Wed Jun 04 18:57:37 EDT 2003 | Rivkin
Hi Guys, How do you calculate throughput? and what's the standard allowance for some hidden downtimes like pick-up miss, pick-up errors, parts/feeder replenishment etc. say i have 4 machines that are not properly balanced in tact time: A= 3 mins
Electronics Forum | Mon Jun 16 14:39:49 EDT 2003 | stepheno
The second one is typical. The important temperature is the temperature of the joint, not the setting of the oven. The oven setting are only important because they determine the temperature of the joint. If you set the oven to 150, that will be th
