Electronics Forum | Wed Oct 24 21:17:13 EDT 2007 | hussman
Ramp rate is measured in degrees per second. Max and min temps are not required to to establish "ramp rate". The difference between parts, like I was describing is Delta T. But, ramp rate is a generation from this as well. Most component manufact
Electronics Forum | Wed Nov 14 13:05:40 EST 2007 | rgduval
I had one project with micro-vias in 0805 and larger pads, with no issues. But my most recent project had vias that were larger than the 0402 pads that the via was in. To the point that for a number of the lands, there was no visible pads (a couple
Electronics Forum | Mon Nov 19 21:42:51 EST 2007 | jwsmt
I'll e-mail pics to you. Answers to asumptions: * Flex in end-item use was measured at 410 microstrain * Supplier PPM last 12 mos less than 1 * Part goes through 2 reflow cycles; once on top and once on bottom * ICT microstrain was 1365; reduced to
Electronics Forum | Fri Jan 04 14:21:35 EST 2008 | ck_the_flip
If all your doing is trying to measure oven repeatability, but then you wanna do it a bunch of times, have a profiling "board" constructed out of say... delmat, delrin, or some other glastic-type pallet material. Have the T/C's permanently fastene
Electronics Forum | Fri Dec 28 08:21:12 EST 2007 | clampron
Good Morning All, I am looking into solder paste inspection systems. I have used a solder paste height inspection system in the past. We have derived less than usefull information from this system as it will only measure the pad that was taught. I h
Electronics Forum | Fri Mar 21 12:39:52 EDT 2008 | stevea
Paste Inspection is critical to the overall printing process. There are at least 40 variables to this process. The idea of using only 2D printer inspection or worse yet, 3D (marginal at best) printer inspection demonstrates a serious gap in coverin
Electronics Forum | Wed Mar 26 16:12:46 EDT 2008 | jlawson
If you have jobs where you can not, there is a company in Japan that makes the best v-groove depanelers called TST, 'guru's in v-groove depanelising'. Their systems can be supplied to reduce stress on cutting to near zero compared to CAB and other lo
Electronics Forum | Thu May 15 19:36:56 EDT 2008 | davef
Q1: static or dynamic? A1: search the fine SMTnet Archives. For instance, http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=44837 Q2: localized testing (C3) or bulk testing (Omegameter/Zero Ion)? A2: depends on the contamination that you're
Electronics Forum | Fri May 30 08:24:08 EDT 2008 | cyber_wolf
The nozzles get centered at zero degrees and 180 degrees. I believe the yellow asterisk is the measurement at zero degrees, when it rotates to 180 is when you will get a red X or a green O. (In other words the yellow asterisk is normal) I think you
Electronics Forum | Tue Jul 01 17:15:03 EDT 2008 | ronhodgson
I would like an interpretation of a solder fillet on a 5 side termination cap. (Ref: IPC-610, sec. 8.2.2.6). My question pertains to the definition of dimension F, and what constitutes the top of the fillet. Does the top of the fillet end at where
