Electronics Forum | Thu Aug 25 15:24:56 EDT 2005 | Arek
Hallo, I have a question about ISO14001 and reflow oven and wave system. What kind of measurment should i do and what should i check to meet ISO 14001.? Where i can find the limits of polutions. Regards Arek
Electronics Forum | Fri Sep 16 02:36:07 EDT 2005 | Steve
We're in process of calculating Cp, Cpk for our CP machines. Does anyone know what we need to have to use Fuji PAM? Thanks Steve
Electronics Forum | Fri Sep 16 14:48:36 EDT 2005 | fuji pam
If you would like to email me at sms8740@juno.com I have all the info you will need.
Electronics Forum | Thu Oct 06 10:57:52 EDT 2005 | SuMoTe
Put a known thickness gage next to your boards to be coated. Then coat it in the same pass as your boards. Measure the "new" thickness of your gage and subtract the difference. That will be your coating thickness. This is assuming your coating your o
Electronics Forum | Tue Feb 28 03:33:29 EST 2006 | snowcaj
To set warm-up time,which standard should we select and how should we measure? Thanks!
Electronics Forum | Tue Nov 22 21:08:45 EST 2005 | davef
CMI International says, there are five basic, non-destructive methods of determining coating thickness. Each method was devised to achieve cost-effective, accurate, and repeatable results. Those methods are: * X-Ray fluorescence * Eddy-current * M
Electronics Forum | Sat Dec 10 07:03:59 EST 2005 | mdemos1
Hi. I am trying to find out the minimum copper thickness I should see on a through hole barrel. The board has 1 ounce copper and the board thickness is 0.062". I am finding thicknesses of 0.6 to 1.2 mils. Thanks, Mike.
Electronics Forum | Thu Dec 29 09:31:45 EST 2005 | pfifla1
I need the bug for the machine, if you could send me over the measurement i would try to get it made. would your owner consider releasing it if i gave him funds to secure its return and then paid him for the time i used it.
Electronics Forum | Tue Jan 17 21:31:48 EST 2006 | KEN
Agreed. Some research sugests the "flexibility" of the joint(s) is reduced with flux only resulting in premature failure as compared to standard paste + ball reflow processes. However, this does not mean it is not a reliable method. Relibility req
Electronics Forum | Mon Apr 03 07:32:56 EDT 2006 | cyber_wolf
I agree. If you put them back in the same place you should be fine. The way you measure/calibrate placing accuracy is by running PAM. This program determines any error in the shafts.
