Electronics Forum | Tue Feb 17 18:17:28 EST 1998 | John Wilson
I am looking for any information or testing data done on the amount of weight that can be held by a bga package based on size of the solder sphere and number of spheres. I am reflowing components with a bga package on the opposite side and looking f
Electronics Forum | Wed Nov 29 01:20:44 EST 2006 | fastek
Guess- If a component drops at the camera the machine will not proceed to attempt to place it and drive the nozzle into a brick of solder paste. The line sensor will catch the fact there is no component on the nozzle and will retry to pick and place.
Electronics Forum | Fri Apr 06 08:32:47 EDT 2007 | davef
Haris: On your soldering issues, we don't know the make-up of your component. We don't know the type solder balls on the component. We don't know the solder paste you plan to use. Your component and paste supplier are better sources for this type o
Electronics Forum | Fri Mar 26 15:48:31 EDT 2021 | grahamcooper22
Leaded HASL on small pads can be quite difficult to print on...the HASL tends to be domed rather than flat..and that can affect print quality...you really need a perfectly flat pcb pad to print paste on when you are assembling 0.5mm QFPs. If the pcb
Electronics Forum | Mon Nov 14 10:10:52 EST 2005 | davef
When soldering your full tin (no lead) and Pb95/Sn5 solder components, you need to modify your PbSn reflow recipe to compensate for the higher melting point of the changed solder alloy [with your Sn62/Pb36/Ag2 solder paste] on those component leads.
Electronics Forum | Fri Jul 04 09:10:53 EDT 2003 | davef
With poorly cured mask: * Wave soldering: Expect to see thin wavy band of dross imbedded in the mask in the wave solder side. * Reflow soldering: Expect to see a pinto board where the two tones of mask are [1] normal color and [2] a lighter color, al
Electronics Forum | Thu Jul 03 08:40:23 EDT 2003 | Kris
Hi, undercured solder resists may be a defect people have seen so far. Some of the probles arising is blistering as well as reaction with wave solder flux that may lead to some kind bad gel like formations. Gels the idea would be to reflow the ba
Electronics Forum | Thu Jul 03 07:59:53 EDT 2003 | loz
OK. Point taken, lets keep this simple then, how about just the issue of under cured solder resist? Any body else encountered such issues. Just feedback, 'cause its something that just seems to have been highlighted to me. Thanks.
Electronics Forum | Thu Jul 03 17:42:01 EDT 2003 | Kris
What have you not seen ?
Electronics Forum | Thu Jul 03 03:23:04 EDT 2003 | loz
I have been advised recently about pcb manufacturers, that somehow or other supply pcb's with contamination. Visually they are fine, but problems arise during SMT manufacture, ie solder balling, non-wetting on pads, and also during wave solder proces
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