Electronics Forum: melf doide poor soldering after reflow (Page 1 of 12)

Palladium poor wetting

Electronics Forum | Tue May 23 09:27:37 EDT 2006 | Steve

Sorry I misled you. The PCB pads are wetting, but there is no fillet being formed. After reflow, it looks as though no paste was put down on the pads; however the paste print is fine. All other components solder real nice, it's only the Pd-Ag parts t

Palladium poor wetting

Electronics Forum | Mon May 22 18:19:29 EDT 2006 | Steve

I have read some threads about poor wetting on palladium-silver (Pd-Ag) coated components. I followed the suggestions, but I am still having a problem. The part is an 0603 chip type (Vishay varistor). The Process: solder paste is lead-free Alpha Met

ENIG poor wetting

Electronics Forum | Tue Jul 30 08:37:39 EDT 2002 | davef

When you talk about 'poor wetting', 'dewett', 'no wets', etc.; are you seeing solder pulling back or away from the pad? Please describe the condition. Dewetting. The condition in the solder joint in which the liquid solder has not adhered intimate

Wetting problem of PCB after reflow soldering

Electronics Forum | Fri Sep 14 15:31:02 EDT 2001 | davef

How in earthly heaven would someone else have a report analyzing the defects on your boards? Among the good failure analysis labs that can assess situations like yours are: * Robisan Laboratory 6502 East 21 St Indianapolis, IN 46219 317-353-6249 fax

Bad wetting after reflow

Electronics Forum | Fri Apr 09 15:00:04 EDT 2010 | davef

So for your SMT1/SMT2/PTH boards, you have poor solderability during SMT2. [Even if you have no SMT2 and only ST1/PTH, our answer is the same.] We assume this occurs on one board part number only. We guess that your bare boards have insufficient gol

solder ball after reflow owen

Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks

Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a

Ag/Pd termination, reflow soldering issues

Electronics Forum | Wed Apr 04 03:07:16 EDT 2007 | pavel_murtishev

Good morning, Problem definition Poor soldering of thermistors with Ag/Pd termination Background Process: lead free reflow soldering Paste type: Multicore LF300, SAC305 Component type: 0805 chip thermistor, Ag/Pd termination PWB finish: immersion A

Golden Finger contamination with Solder after reflow

Electronics Forum | Mon Nov 13 14:58:56 EST 2017 | davef

Determine the origin of the solder * Sloppy paste printing technique * Lax stencil underside cleaning practices * Sloppy misprint cleaning practices * Poor part placement practices creating solder balls * Poor material control allowing solder p

BGA Top Cap Detached after reflow Soldering

Electronics Forum | Sun Jun 12 09:29:41 EDT 2016 | davef

I'd guess that the interconnect pads on the BGA have poor solderability. Confirm this with testing at an independent lab. Work with your supplier to resolve the issue.

QFN - FCT failed after reflow

Electronics Forum | Wed Feb 07 07:45:50 EST 2007 | jax

Water soluble residues probably won't cause instant failures. The failures are most likely caused by excess paste being deposited on the center pad of the QFN. The excess solder keeps the part from sitting down in reflow and increases the possibility

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