Electronics Forum | Thu Apr 18 20:01:28 EDT 2002 | francis khoo
Hello Industry Friends, Can anyone provide me with a guideline to compactflash memory processing requirements please. Regards, Francis Khoo.
Electronics Forum | Thu Apr 18 21:34:35 EDT 2002 | davef
Nothing special. [Follow your paste supplier's recommendations for reflow.] SanDisk� NAND flash memory are sold as TSOP [thin small outline package] devices. Here�s what the innards of a card looks like: http://www.mittoni.com/information/insidecf
Electronics Forum | Fri Dec 16 07:42:05 EST 2005 | pavel_murtishev
Good evening, We noted one more very strange problem with flash memory chips. Device fails test due to flash chip malfunction. From the first sight open joint or cold joint can cause such problem. But all chip legs are soldered well. We just heat th
Electronics Forum | Mon Oct 14 12:39:38 EDT 2013 | lkavan
Dear friends, I have another question about Tenryu MT5530. There is a wrong software on PCMCIA memory card in one machine. Can you help me how to read and write this card. I tried to insert it into notebook PCMCIA slot and it doesn't work, Windows ca
Electronics Forum | Fri Apr 19 23:02:38 EDT 2002 | francis khoo
Hello Dave, Thanks for you input. The website suggested to look into is exactly what I was looking for. I am very happy. Apart from the SMT portion of the process, I was looking at the plastic assembly as well. Do you know if the plastics are welded
Electronics Forum | Fri Apr 19 23:08:14 EDT 2002 | francis khoo
Hello Pete, Thank you very much for your detailed information. Personally, I like shorter solder lands as it would provide a localised solder joint instead of spreading the solder on "unused" location. You have been very helpful. Much appreicated. T
Electronics Forum | Mon Apr 22 19:56:28 EDT 2002 | francis khoo
Hello Pete, Thanks for your insight. I understand and appreciate the NDA situation. I now have a good understanding of the process requirements thanks to you and Dave. Take care and keep in touch. Warm Regards, Francis Khoo.
Electronics Forum | Fri Apr 19 07:50:24 EDT 2002 | pjc
I used to build flash memory products for M-Systems. Up to 30,000 per week. Nothing special in the process for these boards. 1mm and 0.4mm thick std. FR4 PCBs are used. Double-Sided reflow. The 0.4mm thin boards require process carriers. Panelized 24
Electronics Forum | Sun Apr 21 09:52:07 EDT 2002 | pjc
Francis, The problem with shorter solder lands is you may have a problem getting good heal fillets. In the flash products I built the PCBA was inserted into a plastic shell and then we did an epoxy encapsulation using a Camalot machine. Toshiba, Sams
Electronics Forum | Mon Apr 22 09:07:43 EDT 2002 | pjc
Francis, The potting encapsulation process was in the mfg. of flash-disk devices built on a DIP formfactor. Compact flash do not normally get potted. Ultrasonic welding or snap-togther is methods for closing the compact flash housing. The potting mat
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