Electronics Forum | Wed May 02 10:43:39 EDT 2012 | almoore
It might get us closer than the "four corner" or "box" legend suggested above. The surface tension of the meniscus should help pull us in.
Electronics Forum | Wed Oct 20 07:09:12 EDT 2004 | mattkehoe
Not really. Our process is a solid solder deposition application so we are not placing components into the wet paste prior to reflow. We print the paste then reflow is without components, trying to create a meniscus which is then washed, flattened,
Electronics Forum | Fri Jul 07 02:20:03 EDT 2006 | AR
Hi Yes, this is the only component with Ag/Pd finish. I found that by applying a copious amount of solder on the pad (we are using a dispenser) the component will be soldered. Although most of the solder coalesces on the terminations of the componen
Electronics Forum | Sat Nov 07 14:05:43 EST 2009 | doremi
Hi, I have 4 years as an AOI Process Engineer and we are working with 3 types of AOI - Marantz 22X, VI3000 and Omron (RNS & VT-WIN2). For solder joint inspection (solder meniscus quality, insufficient solder, wetting problems, shorts (bridges) Omron
Electronics Forum | Thu Oct 14 17:14:39 EDT 2004 | mattkehoe
We are experiencing a problem with soldermask defined BGA pads not accepting solder during the reflow process. The paste is there when the boards come off the printer but after reflow, no paste. Some other pads in the same pattern are fine. Here is t
Electronics Forum | Thu Dec 16 18:36:01 EST 2004 | mattkehoe
We use water soluble solder paste. When it gets a little dried out, can we add something to rejuvenate it? Liquid flux? We do not place components, just print and reflow the solderpaste so solderballs, spattering, and other issues like those are of
Electronics Forum | Wed Jun 29 17:38:16 EDT 2005 | GS
Several years ago, we had almost same pbm, best results have been obtained by using water soluble paste (those time the old AM1208). Any way, to get a good toe meniscus is not so easy. Talking about CTE, keep in consideration the internal die of TSO
Electronics Forum | Thu Jun 29 02:16:07 EDT 2006 | AR
We are experiencing some difficulties with reflow soldering a 1210-sized MOV with silver/palladium finish. The PCB finish is SAC. When inspecting the board after reflow it seems that nearly all solder is gone both from the pads and the component term
Electronics Forum | Thu Jun 29 06:26:36 EDT 2006 | AR
Hi Slaine, The terminations are still present on the component but all the solder (including the pad finish) has coalesced on to the terminations. The termination that normally is shiny and bright in colour has turned matte grey on that zone where t
Electronics Forum | Thu Nov 30 08:09:19 EST 2006 | INGE
Hi everybody, The matter is this: after reflow, on top side leads of chip components (resistor 0805)appear some empty balls of solder. In some cases this thing is only on the lead and the solder joint seems good, in other cases this empty ball is als
