Electronics Forum: micro materials (Page 1 of 7)

Production Management for micro small firms

Electronics Forum | Wed Aug 27 15:18:51 EDT 2014 | mrp

Hi. I decided to answer to your question, despite this is asked 2 years ago. I believe that my answer will be useful also for others, who visit Lean forums. I would recommend to use some proven MRP SaaS (cloud), because there are many such softwa

Production Management for micro small firms

Electronics Forum | Mon Sep 01 21:26:51 EDT 2014 | proy

We are a smaller company and have created our own systems using FilemakerPro, and it grows and evolves with us as we constantly improve it. Filemaker is a complete relational database system wrapped up WITH the tools to create your user interface -

Production Management for micro small firms

Electronics Forum | Wed Jun 27 22:03:48 EDT 2012 | davef

Here's some notes I've collected over the years on the topic ... Small MRP * I havent used it [DBA Manufacturing] yet but I do find myself keep coming back to it - I have been searching for a decent ERP system for my micro company for years. What I

Gold Thickness

Electronics Forum | Fri Jun 09 08:20:56 EDT 2006 | kehoem@bellsouth.net

We have a board calling out for 50 micro-inches of nickel over 30 micro-inches of gold. This is a solid gold board on Rogers material. ENIG cannot be deposited that thick right? Electroplated gold (we thought) was usually 35-50 micro-inches and was

Immersion Gold (ENIG)

Electronics Forum | Fri Sep 16 11:58:46 EDT 2005 | vinod

Friends, I have a PCB with Immersion GOld (ENIG) finish. Here are the detalis on the PCB. 1. 6 Layers 2. Immersion Gold (ENIG)Nickel 125-250 Micro inch. 3. FR4 Material 4. Thickness 0.062". I am having problem soldering the through hole components.

Immersion Gold (ENIG)

Electronics Forum | Fri Sep 16 13:19:59 EDT 2005 | vinod

Friends, I have a PCB with Immersion GOld (ENIG) finish. Here are the detalis on the PCB. 1. 6 Layers 2. Immersion Gold (ENIG)Nickel 125-250 Micro inch. 3. FR4 Material 4. Thickness 0.062". I am having problem soldering the through hole components.

Re: Conformal Coating that doesn't require fancy equipment...

Electronics Forum | Thu Jun 10 21:09:17 EDT 1999 | Samuel F.

Humiseal probably won't work as most of them are solvent based or require pretty high temp cures. MicroCoat technologies manufacturers UV cure epoxy conformal coating materials that have been used to coat just about anythin (except the green fog) Cal

PbF PCB finish

Electronics Forum | Wed Jan 24 11:27:54 EST 2007 | bradlanger

We have been using SN100C lead free hasl for over a year now with good success. It is very solderable and has good shelf life. You do have to make sure the finish gets applied to the correct thickness. If the lead free hasl finish is not applied thic

Re: uBGA

Electronics Forum | Tue Oct 20 10:57:18 EDT 1998 | Craig Ramsey

Dear Bob, The Tessera microBGA technology defines a family of CSP devices. The most common microBGA type is the TV46 that has been selected by Intel for use with their flash memory devices. A microBGA package in general consists of the silicon die

Re: Solid Solder Deposits

Electronics Forum | Mon Oct 19 17:43:12 EDT 1998 | John Gregory

Ryan - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach

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