Electronics Forum: micro parts handling (Page 1 of 76)

Production Management for micro small firms

Electronics Forum | Wed Jun 27 22:03:48 EDT 2012 | davef

Here's some notes I've collected over the years on the topic ... Small MRP * I havent used it [DBA Manufacturing] yet but I do find myself keep coming back to it - I have been searching for a decent ERP system for my micro company for years. What I

detecting BGA micro cracks

Electronics Forum | Thu Feb 11 08:14:41 EST 2010 | scottp

It's OK to have the daisychain done in the interposer rather than the die (and a lot cheaper) but in thermal cycling the parts MUST have representative die. That's where a large part of the CTE mismatch comes from to cause fatigue damage. Thermal c

detecting BGA micro cracks

Electronics Forum | Mon Feb 08 16:11:10 EST 2010 | glennster

Dave, I agree totally, but dye-and-pry should also be part of the evaluation. Glenn Robertson Process Sciences Inc

detecting BGA micro cracks

Electronics Forum | Wed Feb 10 12:15:40 EST 2010 | woodsmt

Daisy chained parts and impedence testing were my original reccomendation. Unfourtuantely I can not get the resources for this testing.

piece part handling

Electronics Forum | Wed Jul 02 14:25:14 EDT 2003 | Earl Wildes

Greetings. Does anyone know of a good reference on the proper physical handling of surface mount devices? We have a number of very small builds, so our stockroom is very often issuing single piece quantities. The parts are protected from ESD, but

fine pitch/BGA component handling

Electronics Forum | Wed Dec 18 20:08:36 EST 2002 | jonfox

Are your components not in JEDEC trays? We use Kostat trays and we can bake our parts at or up to 150C. What are your temperature requirements, and what are your parts currently being stored in or on? There are a slew of tray makers out there that

fine pitch/BGA component handling

Electronics Forum | Wed Dec 18 19:52:25 EST 2002 | kennyg

Problem: A SMT fine pitch or BGA component needs to be baked due to MS concerns and is needed in a hurry. In some cases the packaging will not allow a high temp/short duration bake. Production will not allow a low temp/long duration bake. If the part

Mydata's handling matrix trays ?

Electronics Forum | Thu Apr 28 16:12:30 EDT 2005 | stepheniii

I was going to say something about being carefull to not replace part trays with full trays and to make sure where the pickup location curently is. I think we had a tray of parts drop, then there were restrictions on who could load trays. When I work

PCB and component handling guidelines

Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis

Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture

PCB and component handling guidelines

Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis

Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture

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