Electronics Forum: microbga (Page 1 of 14)

MicroBGA Footprint

Electronics Forum | Thu May 31 22:47:23 EDT 2007 | alaniesubiron

thanks for the input...

Re: APerture size for microBGA

Electronics Forum | Thu Jun 29 09:46:41 EDT 2000 | sree

Hi Jax, The microbga discussed earlier in the forum is mounted on 16 mils pad whereas mine is on 12 mils pad. Can I use the same aperture opening ?Please advise.

uBGA

Electronics Forum | Mon Jul 12 13:27:35 EDT 1999 | Upinder Singh

Hi all , We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: 1. Is underfill required for micro-BGAs? 2. What type of stencil apertures are the industry standards for uBGAs and of wha

Re: uBGA

Electronics Forum | Tue Oct 20 10:57:18 EDT 1998 | Craig Ramsey

Dear Bob, The Tessera microBGA technology defines a family of CSP devices. The most common microBGA type is the TV46 that has been selected by Intel for use with their flash memory devices. A microBGA package in general consists of the silicon die

problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 09:57:44 EDT 1999 | Vic Lau

Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now using a no

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 10:11:33 EDT 1999 | Dave F

Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 16:19:46 EDT 1999 | Kennyv

Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 16:23:18 EDT 1999 | Kennyv

Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin

MicroBGA qualification process

Electronics Forum | Tue Mar 28 14:20:37 EST 2000 | Reggie Malli

Hello there, Is there a microBGA qualification procedure available somewhere? Does anybody have any experience with X-ray laminography, if so, what are the benefits of laminography versus the standard x-ray? Can somebody point out the study about th

MicroBGA printing problem

Electronics Forum | Mon Sep 20 14:53:24 EDT 1999 | Doug

I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We are using Alpha

  1 2 3 4 5 6 7 8 9 10 Next

microbga searches for Companies, Equipment, Machines, Suppliers & Information